Mechanical Behavior of Materials in Microelectronic and Fiber-optic Systems PDF Download
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Author: American Society of Mechanical Engineers. Winter Annual Meeting Publisher: ISBN: Category : Finite element method Languages : en Pages : 0
Book Description
The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronics and fiber-optic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of engineering mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, to interpret empirical data, and to extrapolate the accumulated experience on new designs. As a rule, application of rational analytical modeling results in substantial savings of time and expense. The review, based primarily on materials science problems related to the mechanical behavior of materials in microelectronics and fiber-optics, and lending themselves to analytical solutions.
Author: American Society of Mechanical Engineers. Winter Annual Meeting Publisher: ISBN: Category : Finite element method Languages : en Pages : 0
Book Description
The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronics and fiber-optic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of engineering mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, to interpret empirical data, and to extrapolate the accumulated experience on new designs. As a rule, application of rational analytical modeling results in substantial savings of time and expense. The review, based primarily on materials science problems related to the mechanical behavior of materials in microelectronics and fiber-optics, and lending themselves to analytical solutions.
Author: Ephraim Suhir Publisher: Springer Science & Business Media ISBN: 9401165351 Category : Science Languages : en Pages : 429
Book Description
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Author: Ephraim Suhir Publisher: Springer ISBN: Category : Juvenile Nonfiction Languages : en Pages : 440
Book Description
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Author: Ephraim Suhir Publisher: Springer Science & Business Media ISBN: 0387329897 Category : Technology & Engineering Languages : en Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Ephraim Suhir Publisher: CRC Press ISBN: 0429863829 Category : Technology & Engineering Languages : en Pages : 344
Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Author: American Society of Mechanical Engineers. Winter Annual Meeting
Author: American Society of Mechanical Engineers. Winter Annual Meeting
Author: Ephraim Suhir
Author: Ephraim Suhir
Author: Ephraim Suhir
Author: Society of Plastics Engineers. Technical Conference
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Author: Ephraim Suhir
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Author: Ephraim Suhir