Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226 PDF Download

Author: Ephraim Suhir
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author: American Society of Mechanical Engineers. Winter Annual Meeting
Publisher:
ISBN:
Category : Finite element method
Languages : en
Pages : 0

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Book Description
The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronics and fiber-optic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of engineering mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, to interpret empirical data, and to extrapolate the accumulated experience on new designs. As a rule, application of rational analytical modeling results in substantial savings of time and expense. The review, based primarily on materials science problems related to the mechanical behavior of materials in microelectronics and fiber-optics, and lending themselves to analytical solutions.

Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234

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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Author: Yichun Zhou
Publisher: CRC Press
ISBN: 1466592435
Category : Science
Languages : en
Pages : 622

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Book Description
This is an English translation of a Chinese textbook that has been designated a national planned university textbook, the highest award given to scientific textbooks in China. The book provides a complete overview of mechanical properties and fracture mechanics in materials science, mechanics, and physics. It details the macro- and micro-mechanical properties of metal structural materials, nonmetal structural materials, and various functional materials. It also discusses the macro and micro failure mechanism under different loadings and contains research results on thin film mechanics, smart material mechanics, and more.

Author: Tze-jer Chuang
Publisher: Springer Science & Business Media
ISBN: 1402039514
Category : Technology & Engineering
Languages : en
Pages : 324

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Book Description
This book is derived from the proceedings of the International Workshop on Nanomechanics held at Asilomar Conference Grounds in Pacific Grove, California on July 14-17, 2004. Approximately 70 leading experts from academia, government and industrial sectors in semiconductors, computers, communication, information technology, defense, energy, transportation and aerospace attended the Workshop (see the workshop photo taken on July 16, 2004). The main objective was to convene leading researchers in the nanotechnology community to assess the current state-of-the-art and disseminate recent progress, critical issues, barriers to applications, and directions for future research in nanomechanics. Miniaturization of structural components and functional devices such as electronic, optical, mechanical and electric-magnetic parts has been a recent trend, and the pace has accelerated over the past few years. Advances in micromanufacturing, semiconductor processing (e.g., etching, lithography, grafting, etc.), sensors, actuators and microprocessors have opened up a revolutionary path to the development of new technologies such as micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), micro-engines, smart structures, smart controllers, lab-- a-chip devices, and even bio-medical sensing devices which can detect, analyze, decide and activate appropriate functions in real time. The above-mentioned devices, structures, or systems, have one issue in common. In order to perform their assigned functions, they must maintain their structural integrity and be reliable and durable during their entire designed service life. Thus, strength, durability, and time-dependent mechanical property degradation are major concerns for design engineers and device manufacturers, even though the parts are designed for electronic, magnetic, optical or other functions.

Author: Thomas H. Courtney
Publisher: Waveland Press
ISBN: 1478608382
Category : Technology & Engineering
Languages : en
Pages : 750

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Book Description
This outstanding text offers a comprehensive treatment of the principles of the mechanical behavior of materials. Appropriate for senior and graduate courses, it is distinguished by its focus on the relationship between macroscopic properties, material microstructure, and fundamental concepts of bonding and crystal structure. The current, second edition retains the original editions extensive coverage of nonmetallics while increasing coverage of ceramics, composites, and polymers that have emerged as structural materials in their own right and are now competitive with metals in many applications. It contains new case studies, includes solved example problems, and incorporates real-life examples. Because of the books extraordinary breadth and depth, adequate coverage of all of the material requires two full semesters of a typical three-credit course. Since most curricula do not have the luxury of allocating this amount of time to mechanical behavior of materials, the text has been designed so that material can be culled or deleted with ease. Instructors can select topics they wish to emphasize and are able to proceed at any level they consider appropriate.

Author: Raghavan Srinivasan
Publisher: Wiley-TMS
ISBN: 9781118889091
Category : Technology & Engineering
Languages : en
Pages : 350

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Book Description
This book focuses on mechanical behavior, deformation, and fracture of materials, and how they play a critical role in the design of mechanical components under a variety of loading conditions. We have taken the approach of educating design engineers the key aspects of mechanical properties of material; in particular test methodologies to obtain important design parameters, and how they are taken into consideration during design for a variety of applications, such as static, fatigue and creep loading. The first part of the book presents an overview of mechanical design data, including the impact of statistical variation. The second section has a detailed discussion of the testing methods for obtaining this data. The third part discusses the role of micro- and macro-structure on mechanical behavior of materials. The emphasis will be on metals used for load bearing applications, with less emphasis on the other three material classes – ceramics, polymers and composites. The last section deals with the application of the above to various design situations.

Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471

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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Author: Eugene Machlin
Publisher: Elsevier
ISBN: 0080460402
Category : Technology & Engineering
Languages : en
Pages : 268

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Book Description
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: • Electrical properties • Magnetic properties • Optical properties • Mechanical properties • Mass transport properties • Interface and junction properties • Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties

Author: Thomas H. Courtney
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 738

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Book Description