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Author: Vinay Divakar Publisher: GRIN Verlag ISBN: 365673089X Category : Technology & Engineering Languages : en Pages : 37
Book Description
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Author: Vinay Divakar Publisher: GRIN Verlag ISBN: 365673089X Category : Technology & Engineering Languages : en Pages : 37
Book Description
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, , course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Author: Jens Lienig Publisher: Springer ISBN: 3319558404 Category : Technology & Engineering Languages : en Pages : 251
Book Description
This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.
Author: James J. Allen Publisher: CRC Press ISBN: 1420027751 Category : Technology & Engineering Languages : en Pages : 492
Book Description
It is challenging at best to find a resource that provides the breadth of information necessary to develop a successful micro electro mechanical system (MEMS) design. Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved,
Author: James G. Skakoon Publisher: American Society of Mechanical Engineers ISBN: 9780791802670 Category : Engineering design Languages : en Pages : 0
Book Description
This book contains principles and practices for mechanical designers and represent engineering fundamentals in a practical way.
Author: Ali Jamnia Publisher: CRC Press ISBN: 1498754023 Category : Technology & Engineering Languages : en Pages : 374
Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Author: Vinay Divakar Publisher: ISBN: 9783656730903 Category : Languages : de Pages : 36
Book Description
Scientific Study from the year 2013 in the subject Engineering - Mechanical Engineering, grade: B+, course: Electronics Systems Design, language: English, abstract: In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described. Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail. Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the
Author: Ansel Ugural Publisher: CRC Press ISBN: 1439887810 Category : Science Languages : en Pages : 1009
Book Description
Mechanical Design of Machine Components, Second Edition strikes a balance between theory and application, and prepares students for more advanced study or professional practice. It outlines the basic concepts in the design and analysis of machine elements using traditional methods, based on the principles of mechanics of materials. The text combine
Author: R. Munnig Schmidt Publisher: IOS Press ISBN: 1614993688 Category : Technology & Engineering Languages : en Pages : 928
Book Description
Since they entered our world around the middle of the 20th century, the application of mechatronics has enhanced our lives with functionality based on the integration of electronics, control systems and electric drives. This book deals with the special class of mechatronics that has enabled the exceptional levels of accuracy and speed of high-tech equipment applied in the semiconductor industry, realising the continuous shrink in detailing of micro-electronics and MEMS. As well as the more frequently presented standard subjects of dynamics, motion control, electronics and electromechanics, this book includes an overview of systems engineering, optics and precision measurement systems, in an attempt to establish a connection between these fields under one umbrella. Robert Munnig Schmidt is professor in Mechatronic System Design at Delft University of Technology with industrial experience at Philips and ASML in research and development of consumer and high-tech systems. He is also director of RMS Acoustics & Mechatronics, doing research and development on active controlled low frequency sound systems. Georg Schitter is professor at the Automation and Control Institute (ACIN) at Vienna University of Technology with a standing track record in research on the control and mechatronic design of extremely fast precision motion systems such as video rate AFM systems. Adrian Rankers is managing partner of Mechatronics Academy, developing and delivering high level courses to the industrial community, based on industrial experience at Philips in the research and development of consumer and high-tech systems. Jan van Eijk is emeritus professor in Advanced Mechatronics at Delft University of Technology. He is also director of MICE BV and partner at Mechatronics Academy, acting as industrial R&D advisor and teacher with experience at Philips in the research and development of consumer and high-tech systems.
Author: Vinay Divakar
Author: Vinay Divakar
Author: James W. Dally
Author: Jens Lienig
Author: James J. Allen
Author: James G. Skakoon
Author: Ali Jamnia
Author: Charles Fraser
Author: Vinay Divakar
Author: Ansel Ugural
Author: R. Munnig Schmidt