Materials Reliability Issues in Microelectronics: Volume 225 PDF Download

Author: James R. Lloyd
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 390

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author: William F. Filter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616

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Book Description
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.

Author: J. Joseph Clement
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488

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Book Description
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.

Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 392

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Book Description
Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.

Author: Ephraim Suhir
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author: Geraldine Cogin Shwartz
Publisher: CRC Press
ISBN: 9780849384660
Category : Technology & Engineering
Languages : en
Pages : 598

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Book Description
Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.

Author: Anthony S. Oates
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 552

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Book Description
This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.

Author: Takao Suzuki
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 376

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Book Description
Contains papers presented as part of the 1991 Spring Meeting of the Materials Research Society.

Author: Robin F. C. Farrow
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 536

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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.