Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 336
Book Description
Materials Reliability in Microelectronics
Constrained Deformation of Materials
Author: Y.-L. Shen
Publisher: Springer Science & Business Media
ISBN: 144196312X
Category : Technology & Engineering
Languages : en
Pages : 290
Book Description
"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Publisher: Springer Science & Business Media
ISBN: 144196312X
Category : Technology & Engineering
Languages : en
Pages : 290
Book Description
"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Advanced Structural Materials
Author: Winston O. Soboyejo
Publisher: CRC Press
ISBN: 1420017462
Category : Technology & Engineering
Languages : en
Pages : 526
Book Description
A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust
Publisher: CRC Press
ISBN: 1420017462
Category : Technology & Engineering
Languages : en
Pages : 526
Book Description
A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
The Optical Properties of Materials: Volume 579
Author: Eric L. Shirley
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 328
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 328
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials for Smart Systems
Amorphous and Heterogeneous Silicon Thin Films
Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 920
Book Description
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 920
Book Description
Materials Science of Microelectromechanical Systems (MEMS) Devices II: Volume 605
Author: Maarten De Boer
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 344
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 344
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
In Situ Process Diagnostics and Modeling: Volume 569
Author: Orlando Auciello
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226
Book Description
Papers from an April 1999 symposium demonstrate the need for the development and application of a variety of complementary in situ, real-time characterization techniques to advance the science and technology of thin films and interfaces critical to the development of a new generation of thin-film-based devices. Papers are arranged in sections on in situ ion and electron-beam analysis, in situ spectroscopic ellipsometry and other optical characterization, in situ diagnostics and modeling, in situ emission and optical characterization techniques, and in situ X-ray, TEM, and STM/AFM characterization and processing control. Auciello is affiliated with Argonne National Laboratory. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 226
Book Description
Papers from an April 1999 symposium demonstrate the need for the development and application of a variety of complementary in situ, real-time characterization techniques to advance the science and technology of thin films and interfaces critical to the development of a new generation of thin-film-based devices. Papers are arranged in sections on in situ ion and electron-beam analysis, in situ spectroscopic ellipsometry and other optical characterization, in situ diagnostics and modeling, in situ emission and optical characterization techniques, and in situ X-ray, TEM, and STM/AFM characterization and processing control. Auciello is affiliated with Argonne National Laboratory. Annotation copyrighted by Book News, Inc., Portland, OR
Ferroelectric Thin Films VIII: Volume 596
Author: R. W. Schwartz
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 610
Book Description
This book, the eighth in a popular series from MRS, features the latest technical information on ferroelectric thin films from an international mix of academia, industry and government organizations. Recent results for DRAM and FERAM devices, as well as enhancements in material performance for these applications, are presented. Significant advances in understanding leakage current, frequency dependence of the coercive field, hydrogen annealing effects, piezoelectric constants, and domain switching responses are highlighted. The development of ferroelectric thin films for piezoelectric applications are also reviewed, as are improved film-fabrication procedures including chemical vapor deposition and chemical solution deposition. Topics include: BST thin films and DRAM; integration and electrodes; Bi-based thin-film ferroelectrics; Pb-based thin-film ferroelectrics; fundamental properties of thin-film ferroelectrics; ferroelectric gate materials and devices; and piezoelectric, pyro-electric and capacitor devices and novel processing strategies.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 610
Book Description
This book, the eighth in a popular series from MRS, features the latest technical information on ferroelectric thin films from an international mix of academia, industry and government organizations. Recent results for DRAM and FERAM devices, as well as enhancements in material performance for these applications, are presented. Significant advances in understanding leakage current, frequency dependence of the coercive field, hydrogen annealing effects, piezoelectric constants, and domain switching responses are highlighted. The development of ferroelectric thin films for piezoelectric applications are also reviewed, as are improved film-fabrication procedures including chemical vapor deposition and chemical solution deposition. Topics include: BST thin films and DRAM; integration and electrodes; Bi-based thin-film ferroelectrics; Pb-based thin-film ferroelectrics; fundamental properties of thin-film ferroelectrics; ferroelectric gate materials and devices; and piezoelectric, pyro-electric and capacitor devices and novel processing strategies.