Author: Paul S. Ho Publisher: Cambridge University Press ISBN: 1107032385 Category : Science Languages : en Pages : 433
Book Description
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Author: Edward R. Myers Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 528
Book Description
Papers of the symposium held April 13-16, 1993 in San Francisco, Calif., on: novel analysis techniques to characterize materials and device properties, process integration, degradation and modelling, CVD, spin pyrolysis, niobium and barium based ferroelectrics, materials and processes, sputter deposition, pulsed laser and other deposition techniques. Annotation copyright by Book News, Inc., Portland, OR
Author: Zhong-lin Wang Publisher: Springer Science & Business Media ISBN: 1461553679 Category : Technology & Engineering Languages : en Pages : 528
Book Description
In the search for new functional materials, a clear understanding about the relationship between the physical properties and the atomic-scale structure of materials is needed. Here, the authors provide graduate students and scientists with an in-depth account of the evolutionary behavior of oxide functional materials within specific structural systems, discussing the intrinsic connections among these different structural systems. Over 300 illustrations and key appendices support the text.
Author: Kenneth P. Rodbell
Author: Paul S. Ho
Author: Mark Alper
Author: George K. Celler
Author: O. J. Glembocki
Author: Edward R. Myers
Author: 
Author: Zhong-lin Wang
Author: K. S. Jones
Author: Robert J. Culbertson