Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Reliability in Microelectronics II: Volume 265
Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Reliability in Microelectronics II:
Author: C. V. Thompson
Publisher: Cambridge University Press
ISBN: 9781107409682
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Cambridge University Press
ISBN: 9781107409682
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electromigration in Metals
Author: Paul S. Ho
Publisher: Cambridge University Press
ISBN: 1107032385
Category : Science
Languages : en
Pages : 433
Book Description
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Publisher: Cambridge University Press
ISBN: 1107032385
Category : Science
Languages : en
Pages : 433
Book Description
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Chemical Perspectives of Microelectronic Materials
Materials Reliability in Microelectronics
Advances in Materials Problem Solving with the Electron Microscope: Volume 589
Author: Jim Bentley
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 432
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 432
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Chemical Processes in Inorganic Materials
Advanced Metallization and Processing for Semiconductor Devices and Circuits - II: Volume 260
Author: Avishay Katz
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1000
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1000
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Scientific Basis for Nuclear Waste Management XVI: Volume 294
Author: Charles G. Interrante
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1006
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book was first published in 1993.
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1006
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book was first published in 1993.
Intermetallic Matrix Composites II: Volume 273
Author: D. B. Miracle
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 464
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 464
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.