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Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Hsinjin Edwin Yang Publisher: William Andrew ISBN: 0128115459 Category : Technology & Engineering Languages : en Pages : 356
Book Description
Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules describes the durability and reliability behavior of polymers used in Si-photovoltaic modules and systems, particularly in terms of physical aging and degradation process/mechanisms, characterization methods, accelerated exposure chamber and testing, module level testing, and service life prediction. The book compares polymeric materials to traditional materials used in solar applications, explaining the degradation pathways of the different elements of a photovoltaic module, including encapsulant, front sheet, back sheet, wires and connectors, adhesives, sealants, and more. In addition, users will find sections on the tests needed for the evaluation of polymer degradation and aging, as well as accelerated tests to aid in materials selection. As demand for photovoltaics continues to grow globally, with polymer photovoltaics offering significantly lower production costs compared to earlier approaches, this book will serve as a welcome resource on new avenues.
Author: J. Joseph Clement Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 488
Book Description
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Author: Wiesław Ostachowicz Publisher: Springer ISBN: 3319390953 Category : Technology & Engineering Languages : en Pages : 432
Book Description
This book provides a holistic, interdisciplinary overview of offshore wind energy, and is a must-read for advanced researchers. Topics, from the design and analysis of future turbines, to the decommissioning of wind farms, are covered. The scope of the work ranges from analytical, numerical and experimental advancements in structural and fluid mechanics, to novel developments in risk, safety & reliability engineering for offshore wind.The core objective of the current work is to make offshore wind energy more competitive, by improving the reliability, and operations and maintenance (O&M) strategies of wind turbines. The research was carried out under the auspices of the EU-funded project, MARE-WINT. The project provided a unique opportunity for a group of researchers to work closely together, undergo multidisciplinary doctoral training, and conduct research in the area of offshore wind energy generation. Contributions from expert, external authors are also included, and the complete work seeks to bridge the gap between research and a rapidly-evolving industry.
Author: Balbir S. Dhillon Publisher: Springer Science & Business Media ISBN: 1848002882 Category : Technology & Engineering Languages : en Pages : 209
Book Description
From its origins in the malachite mines of ancient Egypt, mining has grown to become a global industry which employs many hundreds of thousands of people. Today, the mining industry makes use of various types of complex and sophisticated equipment, for which reliability, maintainability and safety has become an important issue. Mining Equipment Reliability, Maintainability and Safety is the first book to cover these three topics in a single volume. Mining Equipment Reliability, Maintainability and Safety will be useful to a range of individuals from administrators and engineering professionals working in the mining industry to students, researchers and instructors in mining engineering, as well as design engineers and safety professionals. All topics covered in the book are treated in such a manner that the reader requires no previous knowledge to understand the contents. Examples, solutions and test problems are also included to aid reader comprehension.
Author: Alrick L Smith Publisher: Elsevier ISBN: 1483105431 Category : Technology & Engineering Languages : en Pages : 160
Book Description
Reliability of Engineering Materials renders a logical and self-consistent representation of papers from the First European Symposium on Materials Reliability, held in Baden, Switzerland on October 26, 1983. The book starts by giving an introduction and an overview of the reliability of engineering materials. The next two chapters discuss the determination of structural integrity using the simple fracture mechanics model to calculate failure probability and the use of a non-destructive examination for assuring a given level of structural reliability, respectively. The reliability aspects of non-metallic structural materials; metallurgical factors affecting the reliability of materials in high-temperature applications of turbines; and aspects of data bases for materials reliability and their future potential are also considered. The last two chapters of the book present the material reliability data banking and the reliability of materials in heat-exchanger applications. The text will be invaluable to engineers, industrial engineers and metallurgists.
Author: Milton Ohring
Author: Milton Ohring
Author: Electrochemical Society. Meeting
Author: Hsinjin Edwin Yang
Author: J. Joseph Clement
Author: Harry I. McHenry
Author: Wiesław Ostachowicz
Author: Balbir S. Dhillon
Author: D. Misra
Author: Alrick L Smith
Author: Robert B. Comizzoli