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Author: Douglas B. Chrisey Publisher: Cambridge University Press ISBN: 9781107413030 Category : Technology & Engineering Languages : en Pages : 302
Book Description
The goal of this book is to identify and develop new materials approaches based on the direct-write technique (transfer method) and to demonstrate the required electronic or other device performances (chem/bio sensors, phosphor display, FET, etc.). Many different CAD/CAM approaches exist to direct write or transfer material patterns and each technique has its own merits and shortcomings. Many approaches are presented including plasma spray, laser particle guidance, MAPLE DW, laser CVD, micropen, inkjet, e-beam, focused ion beam, and several novel liquid or droplet microdispensing approaches. One common theme to all techniques, however, is their dependence on high-quality starting materials. In most cases, individual direct-write techniques make trade-offs between particle bonding chemistries that are amenable with the transfer process and direct-write properties such as resolution or speed. Optimized materials result in deposition of finer features, minimal process variation and lower prototyping and production costs, higher yields, greater manufacturing flexibility and reduced capital investments. Topics include: relevance of direct-write processing; powder-or droplet-based direct-write processing; laser direct-write techniques and processing; printing methods and consideration for direct-write processing.
Author: Douglas B. Chrisey Publisher: Cambridge University Press ISBN: 9781107413030 Category : Technology & Engineering Languages : en Pages : 302
Book Description
The goal of this book is to identify and develop new materials approaches based on the direct-write technique (transfer method) and to demonstrate the required electronic or other device performances (chem/bio sensors, phosphor display, FET, etc.). Many different CAD/CAM approaches exist to direct write or transfer material patterns and each technique has its own merits and shortcomings. Many approaches are presented including plasma spray, laser particle guidance, MAPLE DW, laser CVD, micropen, inkjet, e-beam, focused ion beam, and several novel liquid or droplet microdispensing approaches. One common theme to all techniques, however, is their dependence on high-quality starting materials. In most cases, individual direct-write techniques make trade-offs between particle bonding chemistries that are amenable with the transfer process and direct-write properties such as resolution or speed. Optimized materials result in deposition of finer features, minimal process variation and lower prototyping and production costs, higher yields, greater manufacturing flexibility and reduced capital investments. Topics include: relevance of direct-write processing; powder-or droplet-based direct-write processing; laser direct-write techniques and processing; printing methods and consideration for direct-write processing.
Author: Alberto Pique Publisher: Academic Press ISBN: 9780121742317 Category : Computers Languages : en Pages : 756
Book Description
Direct-Write Technologies covers applications, materials, and the techniques in using direct-write technologies. This book provides an overview of the different direct write techniques currently available, as well as a comparison between the strengths and special attributes for each of the techniques. The techniques described open the door for building prototypes and testing materials. The book also provides an overview of the state-of-the-art technology involved in this field. Basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. Others in this or related fields will want the book to read the introductory material summarizing isuses common to all approaches, in order to compare and contrast different techniques. Everyday applications include electronic components and sensors, especially chemical and biosensors. There is a wide range of research and development problems requiring state-of-the-art direct write tools. This book will appeal to basic researchers and development engineers in university engineering departments and at industrial and national research laboratories. This text should appeal equally well in the United States, Asia, and Europe. Both basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. An overview of the different direct write techniques currently available A comparison between the strengths and special attributes for each of the techniques An overview of the state-of-the-art technology involved in this field
Author: Ian Gibson Publisher: Springer ISBN: 1493921134 Category : Technology & Engineering Languages : en Pages : 509
Book Description
This book covers in detail the various aspects of joining materials to form parts. A conceptual overview of rapid prototyping and layered manufacturing is given, beginning with the fundamentals so that readers can get up to speed quickly. Unusual and emerging applications such as micro-scale manufacturing, medical applications, aerospace, and rapid manufacturing are also discussed. This book provides a comprehensive overview of rapid prototyping technologies as well as support technologies such as software systems, vacuum casting, investment casting, plating, infiltration and other systems. This book also: Reflects recent developments and trends and adheres to the ASTM, SI, and other standards Includes chapters on automotive technology, aerospace technology and low-cost AM technologies Provides a broad range of technical questions to ensure comprehensive understanding of the concepts covered
Author: Thomas Dietrich Publisher: John Wiley & Sons ISBN: 1118215990 Category : Technology & Engineering Languages : en Pages : 480
Book Description
Microchemical Engineering in Practice provides the information chemists and engineers need to evaluate the use of microreactors, covering the technical, operational, and economic considerations for various applications. It explains the systems needed to use microreactors in production and presents examples of microreactor use in different chemistries, including larger scale production processes. There are guidelines on calculating the costs and the risks of production using continuous flow microreactors. Complete with case studies, this is an essential guide for chemists and engineers interested in investigating the advantages of chemical microreactors.
Author: Surajit Sen Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 338
Book Description
These 38 papers from the April 2000 symposium study granular structure, granular flows, nonlinear waves in granular media, vibrated and rotated granular media, and stress distributions. Topics include jamming in liquids and granular materials, nuclear magnetic resonance studies of granular flows, the blueprint of a concept for a nozzle- free inkjet printer, mixing and segregation processes in a Turbula blender, persistence of granular structure during die compaction of ceramic powders, and humidity-induced cohesion effects in granular media. c. Book News Inc.
Author: Dagmar Hülsenberg Publisher: Springer Science & Business Media ISBN: 3540498885 Category : Science Languages : en Pages : 339
Book Description
This is the first book that explains how to structure glass for micro- and nanophotonic applications. It deals with various glass compositions and their properties, and the interactions between glass and the electromagnetic waves used to modify it. The book also explores methods for influencing the geometrical microstructure of glass as well as methods to produce actual microdevices. It also details methods for influencing the geometrical microstructure of glasses.
Author: R. J. Shul Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 578
Book Description
Interest in wide-bandgap semiconductors for high-power/high-temperature electronics remains prominent. For such applications, SiC is by far the most mature semiconductor material. GaN and diamond, however, have also become prime candidates. While diamond has several advantages over the other two materials, producing large single crystals, as well as the inability to achieve n-type doping, have limited device fabrication. For GaN, recent advances in crystal growth and processing capabilities, as well as excellent transport properties, have yielded a great deal of device development, yet thermal conduction remains an issue. SiC has excellent thermal conductivity, high-breakdown voltages, and well-developed substrates and processing techniques. This book deals with a wide range of technical activity in the area of wide-bandgap high-power/high-temperature electronic devices and covers topics including the fabrication and performance of GaN-based and SiC-based devices, as well as issues related to growth, characterization, and processing of wide-bandgap materials. Several summaries of the current status of the field are provided.
Author: Douglas B. Chrisey
Author: Douglas B. Chrisey
Author: Douglas B. Chrisey
Author: Alberto Pique
Author: Ian Gibson
Author: Kazumi Wada
Author: Thomas Dietrich
Author: Surajit Sen
Author: Shefford P. Baker
Author: Dagmar Hülsenberg
Author: R. J. Shul