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Author: George Russell Harrison Publisher: MIT Press ISBN: 9780262080026 Category : Spectrum analysis Languages : en Pages : 486
Book Description
Contains 110,000 wavelength entries from the 1939 edition with corrections or changes indicated by a line through the entry. Read the introduction to the 1969 edition for further explanation. Wavelengths in the range of 10,000-2,000 A are covered.
Author: George Russell Harrison Publisher: MIT Press ISBN: 9780262080026 Category : Spectrum analysis Languages : en Pages : 486
Book Description
Contains 110,000 wavelength entries from the 1939 edition with corrections or changes indicated by a line through the entry. Read the introduction to the 1969 edition for further explanation. Wavelengths in the range of 10,000-2,000 A are covered.
Author: George Russell Harrison Publisher: ISBN: 9780262160872 Category : Spectrum analysis Languages : en Pages : 0
Book Description
Contains 110,000 wavelength entries from the 1939 edition with corrections or changes indicated by a line through the entry. Read the introduction to the 1969 edition for further explanation. Wavelengths in the range of 10,000-2,000 A are covered.
Author: Robert D. Cowan Publisher: Univ of California Press ISBN: 0520906152 Category : Science Languages : en Pages : 752
Book Description
Both the interpretation of atomic spectra and the application of atomic spectroscopy to current problems in astrophysics, laser physics, and thermonuclear plasmas require a thorough knowledge of the Slater-Condon theory of atomic structure and spectra. This book gathers together aspects of the theory that are widely scattered in the literature and augments them to produce a coherent set of closed-form equations suitable both for computer calculations on cases of arbitrary complexity and for hand calculations for very simple cases.
Author: R.J. Shul Publisher: Springer Science & Business Media ISBN: 3642569897 Category : Technology & Engineering Languages : en Pages : 664
Book Description
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Author: George Russell Harrison
Author: George Russell Harrison
Author: George Russell Harrison
Author: Massachusetts Institute of Technology. Spectroscopy Laboratory
Author: William Frederick Meggers
Author: Robert D. Cowan
Author: William Frederick Meggers
Author: R.J. Shul
Author: William Frederick Meggers
Author: New York Public Library. Research Libraries
Author: