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Author: HUEL H CHANDLER (JR.) Publisher: ISBN: Category : Languages : en Pages : 43
Book Description
Ceramic-to-metal bonding and ceramic adhesives for metals were studied. Successful ceramic-to-metal attachments were made by use of brazing alloys and by mechanical means. The attachment of metal-to-metal with ceramic adhesives was also attained. Small specimens of ceramics and metals were bonded and brazed together. The strength of these bonds was tested at room temperature, 1200 and 1500 F. Some of the brazed specimens exhibited a room temperature tensile strength of 11,000 psi and 5,000 psi when tested at a temperature of 1500 F. The majority of fractures at all temperatures on the brazed ceramic-tometal test specimens occurred at the ceramicmetallized interface or within the ceramic itself. Several ceramic adhesives were employed in efforts to bond various combinations of alumina, pyroceram, Rene'41, Kovar A metal, RS-140 Ti, and 17-7 PH stainless steel. These specimens were tested at room temperature, 600, 800, and 1000 F. 17-7 PH stainless steel bonded with UI-1067-1A ceramic adhesive resulted in a shear strength of 1900 psi when tested at either room temperature or 1000 F.
Author: HUEL H CHANDLER (JR.) Publisher: ISBN: Category : Languages : en Pages : 43
Book Description
Ceramic-to-metal bonding and ceramic adhesives for metals were studied. Successful ceramic-to-metal attachments were made by use of brazing alloys and by mechanical means. The attachment of metal-to-metal with ceramic adhesives was also attained. Small specimens of ceramics and metals were bonded and brazed together. The strength of these bonds was tested at room temperature, 1200 and 1500 F. Some of the brazed specimens exhibited a room temperature tensile strength of 11,000 psi and 5,000 psi when tested at a temperature of 1500 F. The majority of fractures at all temperatures on the brazed ceramic-tometal test specimens occurred at the ceramicmetallized interface or within the ceramic itself. Several ceramic adhesives were employed in efforts to bond various combinations of alumina, pyroceram, Rene'41, Kovar A metal, RS-140 Ti, and 17-7 PH stainless steel. These specimens were tested at room temperature, 600, 800, and 1000 F. 17-7 PH stainless steel bonded with UI-1067-1A ceramic adhesive resulted in a shear strength of 1900 psi when tested at either room temperature or 1000 F.
Author: M. Rühle Publisher: Elsevier ISBN: 1483287467 Category : Technology & Engineering Languages : en Pages : 448
Book Description
As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
Author: Joseph Pask Publisher: Springer Science & Business Media ISBN: 1468439472 Category : Technology & Engineering Languages : en Pages : 733
Book Description
The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.
Author: Alida Bellosi Publisher: Springer Science & Business Media ISBN: 9401719179 Category : Technology & Engineering Languages : en Pages : 471
Book Description
A unique combination of the basic science and fundamental aspects of joints and interfaces with the engineering aspects of the subject. Contributors include researchers drawn from several Eastern European countries. Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation. Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.
Author: Bowen Li Publisher: Springer Nature ISBN: 3030365522 Category : Technology & Engineering Languages : en Pages : 162
Book Description
This collection emphasizes the advances of powder and ceramic materials in fundamental research, technology development, and industrial applications. Ceramic materials science covers the science and technology of creating objects from inorganic, nonmetallic materials, and includes design, synthesis, and fabrication of ceramics, glasses, advanced concretes, and ceramic-metal composites.
Author: M.G. Nicholas Publisher: Springer ISBN: Category : Technology & Engineering Languages : en Pages : 240
Book Description
An examination of the methods used and the types of bonding that occur in the joining of ceramics to glass or metals, both on surfaces and at joints. The book deals with both the physical and chemical aspects of the bonding.
Author: Charles A. Lewinsohn Publisher: John Wiley & Sons ISBN: 1118405900 Category : Technology & Engineering Languages : en Pages : 222
Book Description
Joining remains an enabling technology in several key areas related to the use of ceramics. Development of ceramic materials for electronic, biomedical, power generation, and many other fields continues at a rapid pace. Joining of ceramics is a critical issue in the integration of ceramic components in engineering design. This book includes reviews on the state-of-the-art in ceramic joining, new joining materials and methods, and modeling joint behavior and properties. Proceedings of the symposium held at the 104th Annual Meeting of The American Ceramic Society, April 28-May1, 2002 in Missouri; Ceramic Transactions, Volume 138
Author: David J. Fisher Publisher: Materials Research Forum LLC ISBN: 1644900041 Category : Technology & Engineering Languages : en Pages : 166
Book Description
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Author: HUEL H CHANDLER (JR.)
Author: HUEL H CHANDLER (JR.)
Author: M. Rühle
Author: Joseph Pask
Author: Alida Bellosi
Author: Bowen Li
Author: M.G. Nicholas
Author: Charles A. Lewinsohn
Author: Manferd Ruhle
Author: 
Author: David J. Fisher