Manufacturing Methods and Technology Engineering (MM and TE) Program for the Establishment of Production Techniques for High Density Thick Film Circuits Used in Crystal Oscillators PDF Download
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Author: R. Michel Zilberstein Publisher: ISBN: Category : Languages : en Pages : 248
Book Description
This report compiles the process specifications which define equipment, materials and procedures related to various significant processes employed in manufacture of high density thick film crystal oscillators. (Author).
Author: R. Michel Zilberstein Publisher: ISBN: Category : Languages : en Pages : 248
Book Description
This report compiles the process specifications which define equipment, materials and procedures related to various significant processes employed in manufacture of high density thick film crystal oscillators. (Author).
Author: Publisher: ISBN: Category : Languages : en Pages : 83
Book Description
Production techniques are being established for a thick film hybrid microelectronic 17-22 MHz, temperature-compensated, voltage-controlled crystal oscillator. In the engineering phase of the program, the redesign of the VCXO and TCFG substrates to relieve corral dimension and circuit density problems has been completed. The first lot of engineering samples has progressed through pre-aging electrical testing, and 5 units were undergoing aging at the close of the period. These units are non-conforming, having been assembled prior to the redesign effort. Units using redesigned substrates are in process. (Author).
Author: R. Michel Zilberstein Publisher: ISBN: Category : Languages : en Pages : 210
Book Description
Production techniques have been established for a thick-film hybrid Microelectronic 17-22 MHz, temperature-compensated, voltage controlled quartz crystal oscillator. The program requirements, the plans for meeting those requirements, the technical approach pursued and the technical work accomplished are described. The program was subdivided into an Engineering Phase and a Production phase. The Engineering phase consisted of the following steps: the breadboard analysis of the TCVCXO electrical design; the configuration design of the TCVCXO module; the detailed layout design of the hybrid microcircuity used in the TCVCXO module; the detailed design of piece parts to be used to seal the hybrid microcircuits and to encapsulate the modules; the establishment of process flow plans to produce the modules; and the selection, characterization, and procurement of component parts and materials required for the production of the TCVCXO modules. The Production phase involved the development of tooling and manufacturing techniques needed to achieve the program requirements; and the delivery of completed modules in accordance with the program schedule. (Author).
Author: R. Michel Zilberstein
Author: R. Michel Zilberstein
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Author: R. Michel Zilberstein
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Author: Technology Reports Centre (Great Britain)
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