Manufacturing Investigation for Improved Forming of Boron Carbide PDF Download
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Author: Thomas Vasilos Publisher: ISBN: Category : Languages : en Pages : 30
Book Description
ATERIALS, ARMOR, DENSITY, COST EFFECTIVENESS*ARMOR, *LIGHTWEIGHT, *BORON CARBIDESLightweight, high modulus boron carbide was hot pressed to a density>98 percent of theoretical by alloying additions at a temperature of 1750C and a pressure of 3500 psi. The additives used were 5 percent sodium silicate and 0.5 percent magnesium oxide, added as magnesium nitrate and the mixture was ball milled with steel balls which introduced some iron in the final composition. Microstructure analysis indicated ultrafine-grained structure with average grain size of 0.55 micron. The process has been scaled up to provide 6 in. x 6 in. x 3/8 in. thick tiles, and eight tiles were supplied to AMMRC for ballistic evaluation, which will be the subject of a separate report.
Author: Thomas Vasilos Publisher: ISBN: Category : Languages : en Pages : 30
Book Description
ATERIALS, ARMOR, DENSITY, COST EFFECTIVENESS*ARMOR, *LIGHTWEIGHT, *BORON CARBIDESLightweight, high modulus boron carbide was hot pressed to a density>98 percent of theoretical by alloying additions at a temperature of 1750C and a pressure of 3500 psi. The additives used were 5 percent sodium silicate and 0.5 percent magnesium oxide, added as magnesium nitrate and the mixture was ball milled with steel balls which introduced some iron in the final composition. Microstructure analysis indicated ultrafine-grained structure with average grain size of 0.55 micron. The process has been scaled up to provide 6 in. x 6 in. x 3/8 in. thick tiles, and eight tiles were supplied to AMMRC for ballistic evaluation, which will be the subject of a separate report.
Author: Thomas Vasilos Publisher: ISBN: Category : Languages : en Pages : 28
Book Description
12 IN. X 12 IN. X 3/8 IN. THICKNESS WAS HOT PRESSED TO A DENSITY OF> 98% of theoretical by alloying additions at a temperature of 1750C and a pressure of 3500 psi. Chemical analysis reveals iron as the principal densification aid remaining in the hot pressed structure. Transverse rupture and elastic modulus tests were conducted on samples 1 3/4 in x 1/4 in. x .100 in. cut from a 12 in. x 12 in. tile. The data show the rupture strength decreasing from an average of 73.4 Ksi at room temperature to an average of 38.4 Ksi at 1400C. The elastic modulus decreases from 55.5 x 10 to the 6th power psi at room temperature to 35.5 x 10 to the 6th power psi at 1200C. Hardness measurements taken with a Knoop indenter (100 gm load) range from 2530 to 2670. (Author) Portions of this document are not fully legible.
Author: Andrey A. Radionov Publisher: Trans Tech Publications Ltd ISBN: 3035733384 Category : Technology & Engineering Languages : en Pages : 1444
Book Description
The presented volume contains the scientific articles selected by results of the 4th International Conference on Industrial Engineering (4th ICIE, May 15-18, 2018, Moscow, Russian Federation) which reflect the current achievements in area of materials science, metallurgy, metalworking technologies, polymers, composite materials, ceramics, building materials and chemical technologies. We hope that this collection will be useful and interesting for engineers and researchers from mentioned branches of the engineering science.
Author: Ranganath M. Singari Publisher: Springer Nature ISBN: 9811585423 Category : Technology & Engineering Languages : en Pages : 1180
Book Description
This book presents selected peer reviewed papers from the International Conference on Advanced Production and Industrial Engineering (ICAPIE 2019). It covers a wide range of topics and latest research in mechanical systems engineering, materials engineering, micro-machining, renewable energy, industrial and production engineering, and additive manufacturing. Given the range of topics discussed, this book will be useful for students and researchers primarily working in mechanical and industrial engineering, and energy technologies.
Author: Thomas Vasilos
Author: Thomas Vasilos
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Author: Andrey A. Radionov
Author: Ranganath M. Singari