Managing More-than-Moore Integration Technology Development PDF Download

Author: Riko Radojcic
Publisher: Springer
ISBN: 3319927019
Category : Technology & Engineering
Languages : en
Pages : 207

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Book Description
This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.

Author: Riko Radojcic
Publisher:
ISBN: 9783319927022
Category : Electrical engineering
Languages : en
Pages :

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Book Description
This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way. Based on real, hands-on experiences and presents actual lessons learned; Describes various aspects of managing an engineering development program; Explains key technical aspects of semiconductor technology to non-experts; Written in a novelized form that makes it very easy to read; Enables an understanding of how and why the chip industry evolved over the last 50 years into what it is today.

Author: Walden Rhines
Publisher:
ISBN:
Category :
Languages : en
Pages : 110

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Book Description
The semiconductor industry exhibited life cycles that were longer than the disk drive industry but had the same free market characteristics. Over time this unfettered competition followed trends in a worldwide market that could be quantified and used to predict the future. Over the past forty years or more, I've collected data and made presentations showing how the actual economics and technology of the semiconductor industry can be used to predict its future direction and magnitude. This book is built upon excerpts of presentations made during the last thirty years that analyze the business and technology of the semiconductor industry. In most cases, the figures in the book are copies of the original slides as they were presented during one or more of those presentations. In general, they show how predictable the semiconductor industry has been. They should also provide insight into the future of the industry.

Author: Xiaobing Luo
Publisher: John Wiley & Sons
ISBN: 1119179270
Category : Technology & Engineering
Languages : en
Pages : 373

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Book Description
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Author: Stefan Bosse
Publisher: John Wiley & Sons
ISBN: 3527336060
Category : Technology & Engineering
Languages : en
Pages : 696

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Book Description
Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.

Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 0071627928
Category : Technology & Engineering
Languages : en
Pages : 577

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Book Description
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

Author:
Publisher:
ISBN:
Category : Armed Forces
Languages : en
Pages : 854

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Book Description

Author: Guo Qi Zhang
Publisher: Springer Science & Business Media
ISBN: 0387755934
Category : Technology & Engineering
Languages : en
Pages : 338

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Book Description
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Author: L. Louis Hegedus
Publisher: RTI Press
ISBN: 1934831050
Category : Business & Economics
Languages : en
Pages : 116

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Book Description
The future of the US energy infrastructure is a major and urgent challenge for our society. This monograph was stimulated by a report of the National Academies' Committee on America's Energy Future, America's Energy Future: Technology and Transformation, Summary Edition, 2009. The report pointed out the critical but poorly understood and little explored role of societal considerations in determining the fate of national energy policies and programs. In our efforts to respond to those concerns, we have examined the thesis that the three major dimensions of the energy challenge—technology, economics, and societal—are overlapping, interactive, and inseparable; therefore, they can be understood only when considered simultaneously and discussed in terms of their interactions. Correspondingly, this monograph describes energy technologies in the context of their economic and societal contexts, energy economics in their technological and societal contexts, and the societal aspects of energy in their technological and economic contexts. The monograph then identifies social science–driven research opportunities pertaining to America’s energy challenge, with the hope that the proposed research will help not only overcome the societal barriers identified by the National Academies' report, but also harness societal forces in developing a rational energy future.

Author: Gabriela Nicolescu
Publisher: CRC Press
ISBN: 1351834711
Category : Computers
Languages : en
Pages : 670

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Book Description
The demands of increasingly complex embedded systems and associated performance computations have resulted in the development of heterogeneous computing architectures that often integrate several types of processors, analog and digital electronic components, and mechanical and optical components—all on a single chip. As a result, now the most prominent challenge for the design automation community is to efficiently plan for such heterogeneity and to fully exploit its capabilities. A compilation of work from internationally renowned authors, Model-Based Design for Embedded Systems elaborates on related practices and addresses the main facets of heterogeneous model-based design for embedded systems, including the current state of the art, important challenges, and the latest trends. Focusing on computational models as the core design artifact, this book presents the cutting-edge results that have helped establish model-based design and continue to expand its parameters. The book is organized into three sections: Real-Time and Performance Analysis in Heterogeneous Embedded Systems, Design Tools and Methodology for Multiprocessor System-on-Chip, and Design Tools and Methodology for Multidomain Embedded Systems. The respective contributors share their considerable expertise on the automation of design refinement and how to relate properties throughout this refinement while enabling analytic and synthetic qualities. They focus on multi-core methodological issues, real-time analysis, and modeling and validation, taking into account how optical, electronic, and mechanical components often interface. Model-based design is emerging as a solution to bridge the gap between the availability of computational capabilities and our inability to make full use of them yet. This approach enables teams to start the design process using a high-level model that is gradually refined through abstraction levels to ultimately yield a prototype. When executed well, model-based design encourages enhanced performance and quicker time to market for a product. Illustrating a broad and diverse spectrum of applications such as in the automotive aerospace, health care, consumer electronics, this volume provides designers with practical, readily adaptable modeling solutions for their own practice.