Author: Teresa S. Lazarz Publisher: ISBN: Category : Languages : en Pages :
Book Description
Materials and thin film processing development has been and remains key to continuing to make ever smaller, or miniaturized, microelectronic devices. In order to continue miniaturization, conformal, low-temperature deposition of new electronic materials is needed. Two techniques capable of conformality have emerged: chemical vapor deposition (CVD) and atomic layer deposition (ALD). Here, two processes for deposition of materials which could be useful in microelectronics, but for which no low-temperature, conformal process has been established as commercializable, are presented. One is ruthenium, intended for use in interconnects and in dynamic random access memory electrodes, a known material for use in microelectronics but for which a more conformal, yet fast process than previously demonstrated is required. The other is manganese nitride, which could be used as active magnetic layers in devices or as a dopant in materials for spintronics, which is not yet established as a desired material in part due to the lack of any previously known CVD or ALD process for deposition.
Author: Joseph Zahavi Publisher: ISBN: Category : Languages : en Pages : 60
Book Description
This report results from a contract tasking Technion as follows: Investigate the characteristics of thin silicon nitride films deposited on substrates via the use of chemical laser deposition techniques. This report summarized the research activities during the first year of work as was planned in the proposal. It completes the information which was given in the previous two progress reports. Basically, the aim of the first year was to study the possibility of deposition of silicon nitride thin films from silane and ammonia at low temperatures. The investigation was carried out by studying the effect of substrate temperature on deposition rate and film quality. In addition, the photochemical reaction was studied by analyzing the composition of gas molecules prior and during laser irradiation. At the end of the first year it was also possible to start doing experiments for deposition of silicon carbide from silane and acetylene.
Author: Kecheng Li Publisher: ISBN: Category : Languages : en Pages :
Book Description
Chapter 2 introduces the advantages of DLE-CVD process and its application in deposition of Nickel, Manganese and Copper based thin films. DLE-CVD process is used to deliver consistent and high vapor concentrations of Nickel, Manganese and Copper precursors to coat nanostructures with high aspect ratios.
Author: Publisher: ISBN: Category : Languages : en Pages : 12
Book Description
This is the final report of a three-year, Laboratory Directed Research and Development (LDRD) project at Los Alamos National Laboratory (LANL). The goal of this effort is to study the use of homoleptic metal amido compounds as precursors for chemical vapor deposition (CVD). The amides offer potential for the deposition of a variety of important materials at low temperatures. The establishment of these precursor compounds will enhance the ability to exploit the properties of advanced materials in numerous coatings applications. Experiments were performed to study the reactivity of Sn[NMe2]4 with oxygen. The data demonstrated that gas-phase insertion of oxygen into the Sn-N bond, leading to a reactive intermediate, plays an important role in tin oxide deposition. Several CVD processes for technologically important materials were developed using the amido precursor complexes. These included the plasma enhanced CVD of TiN and Zr3N4, and the thermal CVD of GaN and Al N. Quality films were obtained in each case, demonstrating the potential of the amido compounds as CVD precursors.
Author: Teresa S. Lazarz
Author: 
Author: Jeffrey R. Bottin
Author: JEFFREY L. DUPUIE
Author: Sadanand Vinayak Deshpande
Author: Joseph Zahavi
Author: Kecheng Li
Author: Hsiao C. Liu
Author: Xiaomeng Chen
Author: