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Author: Mohsen Raji Publisher: Springer Nature ISBN: 3031153456 Category : Technology & Engineering Languages : en Pages : 113
Book Description
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Author: Mohsen Raji Publisher: Springer Nature ISBN: 3031153456 Category : Technology & Engineering Languages : en Pages : 113
Book Description
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Author: Jens Lienig Publisher: Springer ISBN: 3319735586 Category : Technology & Engineering Languages : en Pages : 171
Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Ricardo Reis Publisher: Springer ISBN: 1461440785 Category : Technology & Engineering Languages : en Pages : 271
Book Description
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
Author: Aida Todri-Sanial Publisher: CRC Press ISBN: 1351830198 Category : Technology & Engineering Languages : en Pages : 409
Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Elie Maricau Publisher: Springer Science & Business Media ISBN: 1461461634 Category : Technology & Engineering Languages : en Pages : 208
Book Description
This book focuses on modeling, simulation and analysis of analog circuit aging. First, all important nanometer CMOS physical effects resulting in circuit unreliability are reviewed. Then, transistor aging compact models for circuit simulation are discussed and several methods for efficient circuit reliability simulation are explained and compared. Ultimately, the impact of transistor aging on analog circuits is studied. Aging-resilient and aging-immune circuits are identified and the impact of technology scaling is discussed. The models and simulation techniques described in the book are intended as an aid for device engineers, circuit designers and the EDA community to understand and to mitigate the impact of aging effects on nanometer CMOS ICs.
Author: Syed Mohiul Alam Publisher: ISBN: Category : Languages : en Pages : 204
Book Description
Total on-chip interconnect length has been increasing exponentially with technology scaling. Consequently, interconnect-driven design is an emerging trend in state-of-the- art integrated circuits. Cu-based interconnect technology is expected to meet some of the challenges of technology scaling. However, Cu interconnects still pose a reliability concern due to electromigration-induced failure over time. The major contribution of this thesis is a new reliability CAD tool, SysRel, for thermal-aware reliability analysis with either Al or Cu metallization technology in conventional and three-dimensional integrated circuits. An interconnect tree is the fundamental reliability unit for circuit-level reliability assessments for metallization schemes with fully-blocking boundaries at the vias. When vias do not block electromigration as indicated in some Cu experimental studies, multiple trees linked by a non-blocking via are merged to create a single fundamental reliability unit. SysRel utilizes a tree-based hierarchical analysis that sufficiently captures the differences between electromigration behavior in Al and Cu metallizations. The hierarchical flow first identifies electromigration-critical nets or "mortal" trees, applies a default model to estimate the lifetimes of individual trees, and then produces a set of full-chip reliability metrics based on stochastic analysis using the desired lifetime of the circuit. We have exercised SysRel to compare layout-specific reliability with Cu and Al metallizations in various circuits and circuit elements. Significantly improved test-level reliability in Cu is required to achieve equivalent circuit-level reliability. The required improvement will increase as low-k dielectric materials are introduced and liner thicknesses are reduced in future.
Author: Eugene R. Hnatek Publisher: CRC Press ISBN: 1482277719 Category : Technology & Engineering Languages : en Pages : 809
Book Description
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Author: Trent McConaghy Publisher: Springer Science & Business Media ISBN: 1461422698 Category : Technology & Engineering Languages : en Pages : 198
Book Description
This book targets custom IC designers who are encountering variation issues in their designs, especially for modern process nodes at 45nm and below, such as statistical process variations, environmental variations, and layout effects. It teaches them the state-of-the-art in Variation-Aware Design tools, which help the designer to analyze quickly the variation effects, identify the problems, and fix the problems. Furthermore, this book describes the algorithms and algorithm behavior/performance/limitations, which is of use to designers considering these tools, designers using these tools, CAD researchers, and CAD managers.
Author: Bagnato, Alessandra Publisher: IGI Global ISBN: 146666195X Category : Computers Languages : en Pages : 552
Book Description
As real-time and integrated systems become increasingly sophisticated, issues related to development life cycles, non-recurring engineering costs, and poor synergy between development teams will arise. The Handbook of Research on Embedded Systems Design provides insights from the computer science community on integrated systems research projects taking place in the European region. This premier references work takes a look at the diverse range of design principles covered by these projects, from specification at high abstraction levels using standards such as UML and related profiles to intermediate design phases. This work will be invaluable to designers of embedded software, academicians, students, practitioners, professionals, and researchers working in the computer science industry.
Author: Basel Halak Publisher: Springer Nature ISBN: 3030237818 Category : Technology & Engineering Languages : en Pages : 228
Book Description
This book provides comprehensive coverage of the latest research into integrated circuits’ ageing, explaining the causes of this phenomenon, describing its effects on electronic systems, and providing mitigation techniques to build ageing-resilient circuits.
Author: Mohsen Raji
Author: Mohsen Raji
Author: Jens Lienig
Author: Ricardo Reis
Author: Aida Todri-Sanial
Author: Elie Maricau
Author: Syed Mohiul Alam
Author: Eugene R. Hnatek
Author: Trent McConaghy
Author: Bagnato, Alessandra
Author: Basel Halak