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Author: D. Bäuerle Publisher: Springer Science & Business Media ISBN: 3642823815 Category : Science Languages : en Pages : 561
Book Description
Laser processing is now a rapidly increasing field with many real and potential applications in different areas of technology such as micromecha nics, metallurgy, integrated optics, and semiconductor device fabrication. The neces s ity for such soph i st i cated 1 i ght sources as 1 asers is based on the spatial coherence and the monochromaticity of laser light. The spatial coherence permits extreme focussing of the laser light resulting in the availability of high energy densities which can be used for strongly loca lized heat- and chemical-treatment of materials, with a resolution down to 1 ess than 1 lJIll. When us i ng pul sed or scanned cw-l asers, 1 oca 1 i zat i on in time is also possible. Additionally, the monochromaticity of laser light allows for control of the depth of heat treatment and/or selective, nonthermal bond breaking - within the surface of the material or within the molecules of the surrounding reactive atmosphere - simply by tuning the laser wavelength. These inherent advantages of laser light permit micromachining of materials (drilling, cutting, welding etc.) and also allow single-step controlled area processing of thin films and surfaces. Processes include structural transformation (removal of residual damage, grain growth in polycrystalline material, amorphization, surface hardening etc.), etching, doping, alloying, or deposition. In addition, laser processing is not 1 imited to planar substrates.
Author: D. Bäuerle Publisher: Springer Science & Business Media ISBN: 3642823815 Category : Science Languages : en Pages : 561
Book Description
Laser processing is now a rapidly increasing field with many real and potential applications in different areas of technology such as micromecha nics, metallurgy, integrated optics, and semiconductor device fabrication. The neces s ity for such soph i st i cated 1 i ght sources as 1 asers is based on the spatial coherence and the monochromaticity of laser light. The spatial coherence permits extreme focussing of the laser light resulting in the availability of high energy densities which can be used for strongly loca lized heat- and chemical-treatment of materials, with a resolution down to 1 ess than 1 lJIll. When us i ng pul sed or scanned cw-l asers, 1 oca 1 i zat i on in time is also possible. Additionally, the monochromaticity of laser light allows for control of the depth of heat treatment and/or selective, nonthermal bond breaking - within the surface of the material or within the molecules of the surrounding reactive atmosphere - simply by tuning the laser wavelength. These inherent advantages of laser light permit micromachining of materials (drilling, cutting, welding etc.) and also allow single-step controlled area processing of thin films and surfaces. Processes include structural transformation (removal of residual damage, grain growth in polycrystalline material, amorphization, surface hardening etc.), etching, doping, alloying, or deposition. In addition, laser processing is not 1 imited to planar substrates.
Author: Dieter Bäuerle Publisher: Springer Science & Business Media ISBN: 3662032538 Category : Science Languages : en Pages : 649
Book Description
Laser Processing and Chemistry gives an overview of the fundamentals and applications of laser--matter interactions, in particular with regard to laser material processing. Special attention is given to laser-induced physical and chemical processes at gas--solid, liquid--solid, and solid--solid interfaces. Starting with the background physics, the book proceeds to examine applications of laser techniques in micro-machining, and the patterning, coating, and modification of material surfaces. Students, engineers, and manufacturers alike will find this book an invaluable reference work for the state of the art in laser processing.
Author: Charles Blain Publisher: Nova Publishers ISBN: 9781590332252 Category : Technology & Engineering Languages : en Pages : 214
Book Description
Developments in lasers continue to enable progress in many areas such as eye surgery, the recording industry and dozens of others. This book presents citations from the book literature for the last 25 years and groups them for ease of access which is also provided by subject, author and titles indexes.
Author: F. Roozeboom Publisher: Springer Science & Business Media ISBN: 9401587116 Category : Science Languages : en Pages : 568
Book Description
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Author: R.A. Levy Publisher: Springer Science & Business Media ISBN: 1461305411 Category : Science Languages : en Pages : 444
Book Description
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Author: Peter Gray Publisher: Manchester University Press ISBN: 9780719024511 Category : Science Languages : en Pages : 802
Book Description
The results of an International Conference on [title] held in Brussels, Belgium, Aug./Sept. 1987, these papers deal with self-organization and nonlinear dynamics in chemistry, giving the results of recent experiments and bringing new emphasis on spatial inhomogeneities and dynamical phenomena in con"
Author: Dieter Bäuerle Publisher: Springer Science & Business Media ISBN: 3662025051 Category : Science Languages : en Pages : 253
Book Description
Materials processing with lasers is a rapidly expanding field which is increasingly captivating the attention of scientists, engineers and manufacturers alike. The aspect of most interest to scientists is provided by the basic interaction mechanisms between the intense light of a laser and materials exposed to a chemically reactive or nonreactive surrounding medium. Engineers and manufacturers see in the laser a new tool which will not only make manufacturing cheaper, faster, cleaner and more accurate but which also opens up entirely new technologies and manufacturing methods that are simply not available using existing techniques. Actual and potential applications range from laser machining to laser-induced materials transformation, coating, patterning, etc. , opening up the prospect of exciting new processing methods for micromechanics, metallurgy, integrated optics, semiconductor manufacture and chemical engineering. This book concentrates on the new and interdisciplinary field of 1 aser-i nduced chemicaZ process i ng of materi als. The techni que permits maskless single-step deposition of thin films of metals, semiconductors or insulators with lateral dimensions ranging from a few tenths of a micrometer up to several centimeters. Moreover, materials removal or synthesis, or surface modifications, such as oxidation, nitridation, reduction, metallization and doping, are also possible within similar dimensions. This book is meant as an introduction. It attempts to cater for the very broad range of specific interests which different groups of readers will have, and this thinking underlies the way in which the material has been arranged.
Author: D. Bäuerle
Author: D. Bäuerle
Author: Dieter Bäuerle
Author: Charles Blain
Author: M. Meyyappan
Author: F. Roozeboom
Author: R.A. Levy
Author: Peter Gray
Author: Dieter Bäuerle
Author: G. R. Srinivasan
Author: D.J. Ehrlich