La Compatibilite Electromagnetique dans les Circuits Integres PDF Download

Author:
Publisher: Ed. Techniques Ingénieur
ISBN:
Category :
Languages : fr
Pages : 23

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Author: Ramdani
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

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Author: Nicolas Baptistat
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0

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Les progrès des techniques de fabrication des systèmes électroniques permettent de réduire considérablement la taille des composants tout en augmentant les performances des circuits intégrés d'un point de vue rapidité ainsi que de consommation pour n'en citer que quelques-unes. Toutefois, cette révolution technologique génère davantage de problèmes de compatibilité électromagnétique (CEM). Pour pallier cela, les ingénieurs qui conçoivent les circuits électroniques réalisent différents tests de simulations et mesures CEM.Cependant, ces tests peuvent paraître insuffisants du fait qu'ils ne tiennent pas compte des variabilités PVT (Process Voltage Temperature) pouvant induire des variations intolérables des caractéristiques CEM des circuits électroniques produits.Les travaux de cette thèse ont pour but de montrer tout l'intérêt de prendre en considération les variations des paramètres électriques, de température et de processus de fabrication, aussi bien pendant la phase de simulation CEM que pendant la phase de mesures CEM, et de proposer des solutions facilement implémentables pour les entreprises de conception de circuits électroniques.Pour ce faire, ces travaux explorent en particulier l'impact des variations des paramètres caractéristiques des différentes formes d'ondes en sortie de cellules de commutation sur leur spectre fréquentiel. Ces cellules sont construites autour d'un transistor à effet de champ, principal acteur des problèmes CEM.

Author: Chen, Xi
Publisher:
ISBN:
Category :
Languages : fr
Pages : 234

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LA REDUCTION DE L'EMISSION PARASITE EST DEVENUE UNE CONTRAINTE MAJEURE DANS LA CONCEPTION DES CIRCUITS INTEGRES. PORTANT INITIALEMENT SUR LES EQUIPEMENTS ELECTRONIQUES, LA CONTRAINTE DE COMPATIBILITE ELECTROMAGNETIQUE S'EST REPERCUTEE SUR LE COMPOSANT LUI MEME, DU FAIT DE L'EVOLUTION TECHNOLOGIQUE ET DE L'AVENEMENT DES SYSTEMES SUR PUCE. LES CIRCUITS INTEGRES DOIVENT DE CE FAIT ETRE SELECTIONNES, AINSI QUE LEURS COMPOSANTS ENVIRONNANTS, DE MANIERE A RESPECTER LES CONTRAINTES CEM DE L'EQUIPEMENT. CEPENDANT, LE COMPORTEMENT CEM DU COMPOSANT FAIT ENCORE RAREMENT PARTIE DE LA SPECIFICATION INITIALE DE CONCEPTION. DE PLUS, NI METHODOLOGIE, NI OUTILS DE SIMULATION PERFORMANTS NE SONT DISPONIBLE. NOTRE TRAVAIL DE THESE CONSISTE, D'UNE PART, A METTRE EN UVRE DES METHODES DE MESURES FIABLES POUR CARACTERISER L'EMISSION PARASITE DU COMPOSANT. CES METHODES S'APPLIQUENT AU MODE CONDUIT ET RAYONNE, SONT REPRODUCTIVES AFIN DE PERMETTRE DE COMPARER ET EVALUER DIFFERENTS PRODUITS. D'AUTRE PART, NOTRE EFFORT A PORTE SUR LA CONSTRUCTION D'UN MODELE GENERAL DU COMPOSANT AFIN DE PREDIRE L'EMISSION PARASITE DE MANIERE SIMPLE ET PRECISE DE 1 A 1000 MHZ. CETTE APPROCHE PERMET D'ANALYSER L'IMPACT DE TECHNIQUES DE REDUCTION D'EMISSION AVANT LA FABRICATION DU COMPOSANT. NOUS AVONS DECRIT DIFFERENTES TECHNIQUES DE REDUCTION DE L'EMISSION PARASITE AU NIVEAU CIRCUIT INTEGRE ET BOITIER. LE MODELE CEM PROPOSE RESPECTE LA CONFIDENTIALITE DE LA STRUCTURE ET DE LA TECHNOLOGIE, TOUT EN ETANT COMPATIBLE AVEC LES OUTILS DE SIMULATION. LE MODELE EST GENERIQUE, PERMETTANT DE S'ADAPTER A TOUS TYPES DE COMPOSANTS, DES ASIC AUX MICROPROCESSEURS, A DES FINS DE NORMALISATION DE LA DESCRIPTION CEM DES COMPOSANTS. LE TRAVAIL A ETE CONDUIT EN COOPERATION AVEC ST MICROELECTRONICS

Author: Philippe Dunand
Publisher:
ISBN: 9782100029792
Category :
Languages : fr
Pages : 147

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Author: Sonia Ben Dhia
Publisher: Springer Science & Business Media
ISBN: 0387266011
Category : Technology & Engineering
Languages : en
Pages : 478

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Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.

Author: Jean-Michel Redouté
Publisher: Springer Science & Business Media
ISBN: 9048132304
Category : Technology & Engineering
Languages : en
Pages : 249

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Book Description
Environmental electromagnetic pollution has drastically increased over the last decades. The omnipresence of communication systems, various electronic appliances and the use of ever increasing frequencies, all contribute to a noisy electromagnetic environment which acts detrimentally on sensitive electronic equipment. Integrated circuits must be able to operate satisfactorily while cohabiting harmoniously in the same appliance, and not generate intolerable levels of electromagnetic emission, while maintaining a sound immunity to potential electromagnetic disturbances: analog integrated circuits are in particular more easily disturbed than their digital counterparts, since they don't have the benefit of dealing with predefined levels ensuring an innate immunity to disturbances. The objective of the research domain presented in EMC of Analog Integrated Circuits is to improve the electromagnetic immunity of considered analog integrated circuits, so that they start to fail at relevantly higher conduction levels than before.

Author: C. E. Jowett
Publisher: Elsevier
ISBN: 1483103358
Category : Technology & Engineering
Languages : en
Pages : 354

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Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for electronic applications; and humidity corrosion of metallic resistors. The text is recommended for electrical engineers who would like to know more about electrical components, especially those who are interested in the fields of thin films and integrated circuitry.

Author:
Publisher:
ISBN:
Category : Telecommunication
Languages : en
Pages : 372

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Author: Marise Bafleur
Publisher: Elsevier
ISBN: 0081011601
Category : Technology & Engineering
Languages : en
Pages : 286

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Failures caused by electrostatic discharges (ESD) constitute a major problem concerning the reliability and robustness of integrated circuits and electronic systems. This book summarizes the many diverse methodologies aimed at ESD protection and shows, through a number of concrete studies, that the best approach in terms of robustness and cost-effectiveness consists of implementing a global strategy of ESD protection. ESD Protection Methodologies begins by exploring the various normalized test techniques that are used to qualify ESD robustness as well as characterization and defect localization methods aimed at implementing corrective measures. Due to the increasing complexity of integrated circuits, it is important to be able to provide a simulation in which the implemented ESD protection strategy provides the desired protection, while not harming the performance levels of the circuit. Therefore, the main features and difficulties related to the different types of simulation, finite element, SPICE-type and behavioral, are then studied. To conclude, several case studies are presented which provide real-life examples of the approaches explained in the previous chapters and validate a number of the strategies from component to system level. - Provides a global ESD protection approach from component to system, including both the proposal of investigation techniques and predictive simulation methodologies - Addresses circuit and system designers as well as failure analysis engineers - Provides the description of specifically developed investigation techniques and the application of the proposed methodologies to real case studies