Dissertation Abstracts International PDF Download

Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 1006

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Author: Iowa State University
Publisher:
ISBN:
Category : Commencement ceremonies
Languages : en
Pages : 492

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Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650

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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444

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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337

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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266

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Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Author: Yuzhuo Li
Publisher: John Wiley & Sons
ISBN: 0471719196
Category : Technology & Engineering
Languages : en
Pages : 764

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Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Author: E. McCafferty
Publisher: Springer Science & Business Media
ISBN: 1441904549
Category : Science
Languages : en
Pages : 583

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Book Description
This textbook is intended for a one-semester course in corrosion science at the graduate or advanced undergraduate level. The approach is that of a physical chemist or materials scientist, and the text is geared toward students of chemistry, materials science, and engineering. This textbook should also be useful to practicing corrosion engineers or materials engineers who wish to enhance their understanding of the fundamental principles of corrosion science. It is assumed that the student or reader does not have a background in electrochemistry. However, the student or reader should have taken at least an undergraduate course in materials science or physical chemistry. More material is presented in the textbook than can be covered in a one-semester course, so the book is intended for both the classroom and as a source book for further use. This book grew out of classroom lectures which the author presented between 1982 and the present while a professorial lecturer at George Washington University, Washington, DC, where he organized and taught a graduate course on “Environmental Effects on Materials.” Additional material has been provided by over 30 years of experience in corrosion research, largely at the Naval Research Laboratory, Washington, DC and also at the Bethlehem Steel Company, Bethlehem, PA and as a Robert A. Welch Postdoctoral Fellow at the University of Texas. The text emphasizes basic principles of corrosion science which underpin extensions to practice.

Author: Marcel Pourbaix
Publisher: Springer Science & Business Media
ISBN: 1468418068
Category : Science
Languages : en
Pages : 352

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Book Description
Workers in the field of corrosion and their students are most fortunate that a happy set of circumstances brought Dr. Marcel Pourbaix into their field in 1949. First, he was invited, while in the USA, to demonstrate at a two week visit to the National Bureau of Standards the usefulness of his electro chemical concepts to the study of corrosion. Secondly, also around the same time, Prof. H. H. Uhlig made a speech before the United Nations which pointed out the tremendous economic consequences of corrosion. Because of these circumstances, Dr. Pourbaix has reminisced, he chose to devote most of his efforts to corrosion rather than to electrolysis, batteries, geology, or any of the other fields where, one might add, they were equally valuable. This decision resulted in his establishing CEBELCOR (Centre BeIge d'Etude de la Corrosion) and in his development of a course at the Free University of Brussels entitled "Lectures on Electrochemical Corrosion." This book is the collection of these lectures translated into English.

Author: Tony Atkins
Publisher: Butterworth-Heinemann
ISBN: 0080942458
Category : Technology & Engineering
Languages : en
Pages : 428

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The materials mechanics of the controlled separation of a body into two or more parts – cutting – using a blade or tool or other mechanical implement is a ubiquitous process in most engineering disciplines. This is the only book available devoted to the cutting of materials generally, the mechanics of which (toughness, fracture, deformation, plasticity, tearing, grating, chewing, etc.) have wide ranging implications for engineers, medics, manufacturers, and process engineers, making this text of particular interest to a wide range of engineers and specialists. - The only book to explain and unify the process and techniques of cutting in metals AND non-metals. The emphasis on biomaterials, plastics and non-metals will be of considerable interest to many, while the transfer of knowledge from non-metals fields offers important benefits to metal cutters - Comprehensive, written with this well-known author's lightness of touch, the book will attract the attention of many readers in this underserved subject - The clarity of the text is further enhanced by detailed examples and case studies, from the grating of cheese on an industrial scale to the design of scalpels