Author: J. W. Coburn
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 492
Book Description
Plasma Processing
Author: J. W. Coburn
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 492
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 492
Book Description
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 820
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 820
Book Description
Chemical Abstracts
American Doctoral Dissertations
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
Book Description
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
Book Description
Government reports annual index
Index to IEEE Publications
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 722
Book Description
Issues for 1973- cover the entire IEEE technical literature.
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 722
Book Description
Issues for 1973- cover the entire IEEE technical literature.
Dry Etching Technology for Semiconductors
Author: Kazuo Nojiri
Publisher: Springer
ISBN: 3319102958
Category : Technology & Engineering
Languages : en
Pages : 126
Book Description
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Publisher: Springer
ISBN: 3319102958
Category : Technology & Engineering
Languages : en
Pages : 126
Book Description
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Applications of Plasma Processes to VLSI Technology
Author: Takuo Sugano
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 426
Book Description
Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 426
Book Description
Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.
Science Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 948
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 948
Book Description
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description