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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1150

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Author: J. Richard Culham
Publisher:
ISBN:
Category : Ball grid array technology
Languages : en
Pages : 422

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Author: Cristina H. Amon
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1148

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Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312

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Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9811279381
Category : Technology & Engineering
Languages : en
Pages : 479

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Book Description
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Author: Hwaiyu Geng
Publisher: John Wiley & Sons
ISBN: 1118436636
Category : Computers
Languages : en
Pages : 720

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Book Description
Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.

Author: Yogendra Joshi
Publisher: Springer Science & Business Media
ISBN: 1441971246
Category : Science
Languages : en
Pages : 635

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Book Description
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.

Author: Sneh Saurabh
Publisher: CRC Press
ISBN: 1315350262
Category : Science
Languages : en
Pages : 216

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Book Description
During the last decade, there has been a great deal of interest in TFETs. To the best authors’ knowledge, no book on TFETs currently exists. The proposed book provides readers with fundamental understanding of the TFETs. It explains the interesting characteristics of the TFETs, pointing to their strengths and weaknesses, and describes the novel techniques that can be employed to overcome these weaknesses and improve their characteristics. Different tradeoffs that can be made in designing TFETs have also been highlighted. Further, the book provides simulation example files of TFETs that could be run using a commercial device simulator.

Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9814579807
Category : Technology & Engineering
Languages : en
Pages : 471

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Book Description
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Author: Vazgen Melikyan
Publisher: Springer Nature
ISBN: 3031507142
Category : Technology & Engineering
Languages : en
Pages : 351

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Book Description
This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.