ISTFA 2019 PDF Download

Author: ASM International
Publisher:
ISBN: 9781523127870
Category : Quantum computing
Languages : en
Pages : 540

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Book Description

Author:
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540

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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Author:
Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :

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Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561

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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.

Author:
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages :

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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Author: ASM International
Publisher:
ISBN: 9781615030897
Category : Technology & Engineering
Languages : en
Pages : 524

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Book Description

Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634

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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

Author:
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487

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Book Description

Author: Navid Asadizanjani
Publisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193

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Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

Author:
Publisher:
ISBN: 9781680155112
Category : Electronic apparatus and appliances
Languages : en
Pages : 456

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Book Description