Author: A. S. M. International Publisher: ASM International ISBN: 1627080228 Category : Technology & Engineering Languages : en Pages : 634
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: Tejinder Gandhi Publisher: ASM International ISBN: 1627082468 Category : Technology & Engineering Languages : en Pages : 719
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author: Zhiyong Ma Publisher: CRC Press ISBN: 1351733958 Category : Science Languages : en Pages : 1454
Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: Yan Li Publisher: Springer Nature ISBN: 9811570906 Category : Technology & Engineering Languages : en Pages : 629
Book Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author: Wieland Fischer Publisher: Springer ISBN: 3319667874 Category : Computers Languages : en Pages : 709
Book Description
This book constitutes the proceedings of the 19th International Conference on Cryptographic Hardware and Embedded Systems, CHES 2017, held in Taipei, Taiwan, in September 2017. The 33 full papers presented in this volume were carefully reviewed and selected from 130 submissions. The annual CHES conference highlights new results in the design and analysis of cryptographic hardware and soft- ware implementations. The workshop builds a valuable bridge between the research and cryptographic engineering communities and attracts participants from industry, academia, and government organizations.
Author: F.H. Froes Publisher: ASM International ISBN: 1627080805 Category : Technology & Engineering Languages : en Pages : 417
Book Description
This new book covers all aspects of the history, physical metallurgy, corrosion behavior, cost factors and current and potential uses of titanium. The history of titanium is traced from its early beginnings through the work of Kroll, to the present day broadening market place. Extensive detail on extraction processes is discussed, as well as the various beta to alpha transformations and details of the powder metallurgy techniques.
Author: Yan Li Publisher: Springer Nature ISBN: 9811950539 Category : Technology & Engineering Languages : en Pages : 628
Book Description
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Author: Mahmoud Y. Demeri Publisher: ASM International ISBN: 1627080058 Category : Business & Economics Languages : en Pages : 312
Book Description
Examines the types, microstructures and attributes of AHSSAlso reviews the current and future applications, the benefits, trends and environmental and sustainability issues.
Author: Somnath Ghosh Publisher: Springer Nature ISBN: 3030405621 Category : Technology & Engineering Languages : en Pages : 416
Book Description
This book introduces research advances in Integrated Computational Materials Engineering (ICME) that have taken place under the aegis of the AFOSR/AFRL sponsored Center of Excellence on Integrated Materials Modeling (CEIMM) at Johns Hopkins University. Its author team consists of leading researchers in ICME from prominent academic institutions and the Air Force Research Laboratory. The book examines state-of-the-art advances in physics-based, multi-scale, computational-experimental methods and models for structural materials like polymer-matrix composites and metallic alloys. The book emphasizes Ni-based superalloys and epoxy matrix carbon-fiber composites and encompasses atomistic scales, meso-scales of coarse-grained models and discrete dislocations, and micro-scales of poly-phase and polycrystalline microstructures. Other critical phenomena investigated include the relationship between microstructural morphology, crystallography, and mechanisms to the material response at different scales; methods of identifying representative volume elements using microstructure and material characterization, and robust deterministic and probabilistic modeling of deformation and damage. Encompassing a slate of topics that enable readers to comprehend and approach ICME-related issues involved in predicting material performance and failure, the book is ideal for mechanical, civil, and aerospace engineers, and materials scientists, in in academic, government, and industrial laboratories.
Author: A. S. M. International
Author: Tejinder Gandhi
Author: Zhiyong Ma
Author: Yan Li
Author: Wieland Fischer
Author: F.H. Froes
Author: Yan Li
Author: 
Author: Mahmoud Y. Demeri
Author: Somnath Ghosh