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IPC-9201A-JP Surface Insulation Resistance Handbook (Japanese)

IPC-9201A-JP Surface Insulation Resistance Handbook (Japanese) PDF Author: IPC International
Publisher:
ISBN: 9781638161615
Category :
Languages : en
Pages : 0

Book Description

IPC-9201A-JP Surface Insulation Resistance Handbook (Japanese)

IPC-9201A-JP Surface Insulation Resistance Handbook (Japanese) PDF Author: IPC International
Publisher:
ISBN: 9781638161615
Category :
Languages : en
Pages : 0

Book Description

Surface Insulation Resistance Handbook

Surface Insulation Resistance Handbook PDF Author: Ateneo de Manila University. Institute of Philippine Culture
Publisher:
ISBN: 9781580980852
Category : Electronic apparatus and appliances
Languages : en
Pages : 64

Book Description

IPC/WHMA A 620B - Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA A 620B - Requirements and Acceptance for Cable and Wire Harness Assemblies PDF Author: IPC Staff
Publisher:
ISBN: 9781611930665
Category :
Languages : en
Pages :

Book Description

IPC-0040

IPC-0040 PDF Author: IPC (Organization)
Publisher:
ISBN: 9781580987165
Category : Electronic packaging
Languages : en
Pages : 158

Book Description

Lead-Free Electronic Solders

Lead-Free Electronic Solders PDF Author: KV Subramanian
Publisher: Springer Science & Business Media
ISBN: 0387484337
Category : Technology & Engineering
Languages : en
Pages : 370

Book Description
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

The Electronic Packaging Handbook

The Electronic Packaging Handbook PDF Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 9781420049848
Category : Technology & Engineering
Languages : en
Pages : 648

Book Description
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
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