Author: Stuart HutchinsonPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Ion Implantation Techniques for the Fabrication of Gallium Arsenide Multilayer Microwave Devices
Author: Stuart HutchinsonInvestigations of Technical Problems in Gallium Arsenide
Author: Fred H. EisenPublisher:
ISBN:
Category :
Languages : en
Pages : 106
Book Description
Various technological problems in the development of GaAs microwave devices are covered in this report. The work reported here includes: epitaxial growth of ultra-thin and high-resistivity films, study of the relationship between device performance and material parameters using IMPATT diodes, annealing study of n-n(+) interfaces to improve their electrical properties, growth of semi-insulating substrates and characterization techniques, and study of ion implantation as a tool for microwave device fabrication.
Ion Implantation: Basics to Device Fabrication
Author: Emanuele RiminiPublisher: Springer Science & Business Media
ISBN: 9780792395201
Category : Technology & Engineering
Languages : en
Pages : 418
Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Scientific and Technical Aerospace Reports
Author: Ion Implantation in Semiconductors
Author: Susumu NambaPublisher: Springer Science & Business Media
ISBN: 1468421514
Category : Science
Languages : en
Pages : 716
Book Description
The technique of ion implantation has become a very useful and stable technique in the field of semiconductor device fabrication. This use of ion implantation is being adopted by industry. Another important application is the fundamental study of the physical properties of materials. The First Conference on Ion Implantation in Semiconductors was held at Thousand Oaks, California in 1970. The second conference in this series was held at Garmish-Partenkirchen, Germany, in 1971. At the third conference, which convened at Yorktown Heights, New York in 1973, the emphasis was broadened to include metals and insulators as well as semiconductors. This scope of the conference was still accepted at the fourth conference which was held at Osaka, Japan, in 1974. A huge number of papers had been submitted to this conference. All papers which were presented at the Fourth International Conference on Ion Implantation in Semiconductors and Other Materials are included in this proceedings. The success of this conference was due to technical presentations and discussions of 224 participants from 14 countries as well as to financial support from many companies in Japan. On behalf of the committee, I wish to thank the authors for their excellent papers and the sponsors for their financial support. The International Committee responsible for advising this conference consisted of B.L. Crowder, J.A. Davies, G. Dearna1ey, F.H. Eisen, Ph. G1otin, T. Itoh, A.U. MacRae, J.W. Mayer, S. Namba, I. Ruge, and F.L. Vook.
Ion Implantation in Microelectronics
Author: A. H. AgajanianPublisher: Springer
ISBN:
Category : Reference
Languages : en
Pages : 282
Book Description
During the past ten years the use of ion implantation for doping semiconductors has become an active area of research and new device development. This doping technique has recently reached a level of maturity such that it is an integral step in the manu facturing of discrete semiconductor devices and integrated circuits. Ion implantation has significant advantages over diffusion such as: precision, purity, versatility, and automation; all of which are important for VLSI purposes. Ion implantation has also found new applications in magnetic bubble domain materials, superconductors, and materials synthesis. This book is a comprehensive bibliography of 2467 references of the world's literature on ion implantation as applied to micro electronics. This compilation will easily enable researchers to compare their work with that of others. For easy access to the needed references, the contents are divided into fifty-two subject headings. The main categories are: bibliographies, books and symposia, review articles, theory, materials, device applications, and equipment. An author index and a subject index are also given to provide easy access to the references. The literature from January 1976 to December 1980 is covered. The literature prior to 1976 is the subject, in part, of a previous book by the author (1). The main sources searched were: Physics Abstracts (PA) , Electrical and Electronics Abstracts (EEA) , Chemical Abstracts (CA) , Nuclear Science Abstracts (NSA) , and Engineering Index. The volumes and numbers of the abstracts are given to pro vide access to the abstracts.
High-energy Ion-implantation Into InP and GaAs for Microwave Device Applications
Author: Jayadev VellankiIon Implantation: Basics to Device Fabrication
Author: Emanuele RiminiPublisher: Springer
ISBN: 9781461522607
Category : Technology & Engineering
Languages : en
Pages : 393
Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Ion Implantation and Laser Processing of III-V Compound Semiconductors with Applications to the Fabrication of Microwave Devices
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 44
Book Description
Research was carried out on laser processing of III-V Compound semiconductors, concentrating on the mechanisms that are responsible for annealing ion implanted dopants in GaAs and on the possibility of obtaining laser-assisted diffusion of dopants. Seven papers describing this work have been written during the period covered by this report. A brief overview of these papers is given. The full papers are attached for detailed presentation of experimental conditions, theoretical calculations and results. (Author).
Diffusion and Electrical Properties of Sulfur Implanted in Gallium Arsenide
Author: Siu Sing ChanPublisher:
ISBN:
Category : Diffusion
Languages : en
Pages : 172
Book Description
As the need for high speed devices and circuits continues to grow, GaAs has received increasing attention as a viable (both technologically and economically) electronic material complementary to Si. The advantages of GaAs lie in its much higher electron mobility and its compatibility with optoelectronic devices. The merits of a planar process have been well demonstrated in Si technology, and in the course of the development of a similar process for GaAs, ion implantation has emerged as an indispensable tool. Ion implantation is inherently a much more precise and controllable method of selective semiconductor doping than diffusion. To attain the degree of line-width control necessary for high speed or high density devices, ion implantation is a prerequisite. Besides, many useful dopants in GaAs cannot be introduced readily by diffusion because of material constraints. In spite of its importance in the fabrication of devices which take advantage of the high electron mobility of GaAs, donor implantation in GaAs has not found as much success as acceptor implantations. In order to avoid amphoteric tendencies and possible self-compensation mechanisms, it is generally best to use a column VI element.