Author: Claës I. HelgessonPublisher:
ISBN:
Category :
Languages : sv
Pages : 121
Book Description
Investigation of the bonding mechanism between metals and ceramics
Author: Claës I. HelgessonInvestigation of the Bonding Mechanism Between Metals and Ceramics
Author: Claës I. HelgessonPublisher:
ISBN:
Category : Ceramic to metal bonding
Languages : en
Pages : 154
Book Description
Investigation of the Bonding Mechanisms Between Metals and Ceramics
Author: Claës Ivar HelgessonPublisher:
ISBN:
Category :
Languages : en
Pages : 121
Book Description
Investigation of Bonding Between Metals and Ceramics
Author: H. J. HamjianPublisher:
ISBN:
Category : Boron compounds
Languages : en
Pages : 30
Book Description
The experiments conducted with boron carbide and each of four metals showed that nickel, cobalt, and iron formed a bonding zone between the metal and the ceramic and that chromium showed satisfactory physical wetting characteristics on the ceramic.
Investigation of Bonding Between Metals and Ceramics
Author: H. J. HamjianPublisher:
ISBN:
Category : Boron compounds
Languages : en
Pages : 696
Book Description
The experiments conducted with boron carbide and each of four metals showed that nickel, cobalt, and iron formed a bonding zone between the metal and the ceramic and that chromium showed satisfactory physical wetting characteristics on the ceramic.
An Investigation of the Bonding Mechanism of Metal-silicon Carbide Mixtures
Author: Richard A. AlliegroPublisher:
ISBN:
Category : Silicon carbide
Languages : en
Pages : 53
Book Description
Ceramic-to-metal Bonding
Author: Claës I. HelgessonPublisher:
ISBN:
Category : Ceramic to metal bonding
Languages : en
Pages : 136
Book Description
Progress Report on Study of Metal-ceramic Interactions at Elevated Temperatures
Author: F. H. NortonPublisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 10
Book Description
Joining of Titanium
Author: Robert Edward MonroePublisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 86
Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Surfaces and Interfaces in Ceramic and Ceramic — Metal Systems
Author: Joseph PaskPublisher: Springer Science & Business Media
ISBN: 1468439472
Category : Technology & Engineering
Languages : en
Pages : 733
Book Description
The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.