Investigation of Industrially-Suited Processes for Deposition of Oxide Thin Films by High Power Impulse Magnetron Sputtering PDF Download
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Author: Felipe de Campos Carreri Publisher: Fraunhofer Verlag ISBN: 9783839612873 Category : Technology & Engineering Languages : en Pages : 0
Book Description
The scope of this work is to investigate and to develop advanced HIPIMS processes for deposition of oxides, utilizing industrial-scale equipment and technology. Two classes of oxide materials were studied: insulating (aluminum oxide) and conducting oxides (indium-tin oxide and aluminum-doped zinc oxide). The electrical properties of the oxides have a significant influence on the process design, as the issues and approaches for deposition of insulating materials are fairly different from conducting materials. Different types of reactive process control were also investigated, utilizing optical emission spectroscopy to control the oxygen flow and lambda probes to control the discharge power. A non-reactive process was also studied for indium-tin oxide.
Author: Felipe de Campos Carreri Publisher: Fraunhofer Verlag ISBN: 9783839612873 Category : Technology & Engineering Languages : en Pages : 0
Book Description
The scope of this work is to investigate and to develop advanced HIPIMS processes for deposition of oxides, utilizing industrial-scale equipment and technology. Two classes of oxide materials were studied: insulating (aluminum oxide) and conducting oxides (indium-tin oxide and aluminum-doped zinc oxide). The electrical properties of the oxides have a significant influence on the process design, as the issues and approaches for deposition of insulating materials are fairly different from conducting materials. Different types of reactive process control were also investigated, utilizing optical emission spectroscopy to control the oxygen flow and lambda probes to control the discharge power. A non-reactive process was also studied for indium-tin oxide.
Author: Peter M. Martin Publisher: William Andrew ISBN: 0815520328 Category : Technology & Engineering Languages : en Pages : 932
Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Author: Diederik Depla Publisher: Springer Science & Business Media ISBN: 3540766642 Category : Technology & Engineering Languages : en Pages : 584
Book Description
In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.
Author: Daniel Lundin Publisher: Elsevier ISBN: 0128124547 Category : Technology & Engineering Languages : en Pages : 398
Book Description
High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes. Lastly, the book also looks at how to characterize the HiPIMS discharge, including essential diagnostic equipment. Experimental results and simulations based on industrially relevant material systems are used to illustrate mechanisms controlling nucleation kinetics, column formation and microstructure evolution.
Author: Krishna Seshan Publisher: William Andrew ISBN: 0128123125 Category : Technology & Engineering Languages : en Pages : 472
Book Description
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Author: Jaydeep Sarkar Publisher: William Andrew ISBN: 0815519877 Category : Technology & Engineering Languages : en Pages : 614
Book Description
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . - Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements - Practical information on technology trends, role of sputtering and major OEMs - Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. - Practical case-studies on target performance and troubleshooting - Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry
Author: Yao Jin Publisher: ISBN: Category : Languages : en Pages :
Book Description
A vanadium oxide (VO x) thin film is the most common imaging layer used in commercial uncooled focal plane arrays for infrared cameras. These VOx thin films have an x value ranging from 1.3 to 2 and have low resistivity (0.1 to 10 [omega] cm), high temperature coefficient of resistance (TCR) (-2 to -3 %/K), and low 1/f noise. Reactive ion beam sputtering is typically used to deposit these VOx thin films for commercial thermal imaging cameras. However, the reactive ion beam deposition system for the VOx is reported to have less than desirable throughput and a narrow process window. In this work, the potential for reactive pulsed-dc magnetron sputtering of nanocomposite VOx thin films for microbolometer applications was investigated. VOx thin films with resistivity from 10-4 to 105 [omega] cm with a TCR from 0 to -4.3 %/K were deposited by reactive sputtering from a metallic vanadium target in argon/oxygen mixtures with substrate bias. Magnetron sputtered VOx shows bolometric properties comparable to those of commercial-grade IBD prepared VOx. Important limitations for manufacturing implementation of reactive magnetron sputtering such as hysteresis oxidation and non-uniform oxidation of the vanadium target surface were evaluated. The VOx film deposition rate, resistivity, and temperature coefficient of resistance were correlated to oxygen to argon ratio, processing pressure, target-to-substrate distance, and oxygen inlet positions. To deposit VOx in the resistivity range of 0.1--10 [omega] cm with good uniformity and process control, it was found that a lower processing pressure, larger target-to-substrate distance, and an oxygen inlet near the substrate are useful. Other processing methods employing magnetron sputtering were investigated such as co-sputtering of V and V2O5 target, sputtering from a VC target, a V2O5 target, and a V2Ox target but initial investigation of these methods did not yield a superior process to the simple sputtering of a pure metallic vanadium target. Another technique, biased target ion beam deposition (BTIBD), was investigated for deposition VOx thin films with potential alloy additions. In this BTIBD system, ions with energy lower than 25 eV were generated remotely and vanadium targets are negatively biased independently for sputtering. High TCR (
Author: Kiyotaka Wasa Publisher: William Andrew ISBN: 1437734839 Category : Science Languages : en Pages : 658
Book Description
This thoroughly updated new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. It forms a bridge between fundamental theory and practical application, giving an insight into innovative new materials, devices and systems. Organized into three parts for ease of use, this Handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS. Wide varieties of functional thin film materials and processing are described, and experimental data is provided with detailed examples and theoretical descriptions. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere
Book Description
Cathodic arcs are among the longest studied yet least understood objects in science. Plasma-generating, tiny spots appear on the cathode; they are highly dynamic and hard to control. With an approach emphasizing the fractal character of cathode spots, strongly fluctuating plasma properties are described such as the presence of multiply charged ions that move with supersonic velocity. Richly illustrated, the book also deals with practical issues, such as arc source construction, macroparticle removal, and the synthesis of dense, well adherent coatings. The book spans a bridge from plasma physics to coatings technology based on energetic condensation, appealing to scientists, practitioners and graduate students alike.
Author: Felipe de Campos Carreri
Author: Felipe de Campos Carreri
Author: Peter M. Martin
Author: Diederik Depla
Author: Daniel Lundin
Author: Asim Aijaz
Author: Krishna Seshan
Author: Jaydeep Sarkar
Author: Yao Jin
Author: Kiyotaka Wasa
Author: André Anders