Author: Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 117
Book Description
International Tin Symposium ; 2
Author: Symposium on Tin
Author: International Tin Symposium ; 3
Author: TIN IN THE HISTORY OF SCIENCE TECHNOLOGY AND ART- AN INTERNATIONAL SYMPOSIUM- 2 VOLS.
Author: A Second Technical Conference on Tin
Author: Technical Conference on Tin 2, 1969, KruṅdebPublisher:
ISBN:
Category :
Languages : en
Pages : 452
Book Description
The International Tin Trade
Author: Peter RoddyPublisher: Elsevier
ISBN: 1845699203
Category : Science
Languages : en
Pages : 283
Book Description
A practical and authoritative book covering every aspect of the tin trade beginning with its origins and history including the traumatic events of 1985 and their aftermath, and going on to deal with the mining and production processes. Aspects of the trading process are covered including trading techniques and strategies in both physical and futures markets.
Symposium on Tin
Author: Committee B-2 StaffPublisher:
ISBN: 9780803160781
Category :
Languages : en
Pages :
Book Description
The International Tin Cartel
Author: John HillmanPublisher: Routledge
ISBN: 1135151326
Category : Business & Economics
Languages : en
Pages : 497
Book Description
This book brings together two areas of inquiry, the history of tin and its role in producing countries and the history of cartelization as a solution to the inherent difficulties of primary commodity markets.
Lead-free Solders
Author: K. SubramanianPublisher: John Wiley & Sons
ISBN: 1119966809
Category : Technology & Engineering
Languages : en
Pages : 510
Book Description
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
The Houston List of Scientific and Technical Serial Publications
Author: Committee for the Development of Library ResourcesPublisher:
ISBN:
Category :
Languages : en
Pages : 342
Book Description