International Test Conference, 1992 PDF Download

Author: Institute of Electrical and Electronics Engineers
Publisher: Conference
ISBN:
Category : Automatic checkout equipment
Languages : en
Pages : 1032

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Book Description
Annotation The proceedings of the 23rd edition of the premier technical conference on electronic testing, held in Baltimore, Maryland, September 1992, comprise papers, panels, and tutorials in the areas of design and test integration; test management; software; test hardware; device, assembly, and system test; and IEEE test standards. ITC's 1992 theme, Discover the New World of Test and Design, reflects the growing emphasis on tighter integration of test and design to assure the highest quality products. No subject index. Ruggedly bound for heavy use. Annotation copyrighted by Book News, Inc., Portland, OR.

Author: S. Chakravarty
Publisher: Springer Science & Business Media
ISBN: 146156137X
Category : Technology & Engineering
Languages : en
Pages : 336

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Book Description
Testing techniques for VLSI circuits are undergoing many exciting changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last fifteen years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers. Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than fifteen years of research in this area.

Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161

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Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Author: Jaume Segura
Publisher: John Wiley & Sons
ISBN: 9780471476696
Category : Technology & Engineering
Languages : en
Pages : 370

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Book Description
CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering bottom line. This book educates readers, including non-engineers involved in CMOS manufacture, to identify and remedy these causes. This book instills the electronic knowledge that affects not just design but other important areas of manufacturing such as test, reliability, failure analysis, yield-quality issues, and problems. Designed specifically for the many non-electronic engineers employed in the semiconductor industry who need to reliably manufacture chips at a high rate in large quantities, this is a practical guide to how CMOS electronics work, how failures occur, and how to diagnose and avoid them. Key features: Builds a grasp of the basic electronics of CMOS integrated circuits and then leads the reader further to understand the mechanisms of failure. Unique descriptions of circuit failure mechanisms, some found previously only in research papers and others new to this publication. Targeted to the CMOS industry (or students headed there) and not a generic introduction to the broader field of electronics. Examples, exercises, and problems are provided to support the self-instruction of the reader.

Author: Manoj Sachdev
Publisher: Springer Science & Business Media
ISBN: 0387465472
Category : Technology & Engineering
Languages : en
Pages : 343

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Book Description
The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.

Author: Manoj Sachdev
Publisher: Springer Science & Business Media
ISBN: 1475749260
Category : Technology & Engineering
Languages : en
Pages : 317

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Book Description
Defect oriented testing is expected to play a significant role in coming generations of technology. Smaller feature sizes and larger die sizes will make ICs more sensitive to defects that can not be modeled by traditional fault modeling approaches. Furthermore, with increased level of integration, an IC may contain diverse building blocks. Such blocks include, digital logic, PLAs, volatile and non-volatile memories, and analog interfaces. For such diverse building blocks, traditional fault modeling and test approaches will become increasingly inadequate. Defect oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits (ICs) have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of highest possible quality. Testing, in general and, defect oriented testing, in particular, help in realizing these objectives. Defect Oriented Testing for CMOS Analog and Digital Circuits is the first book to provide a complete overview of the subject. It is essential reading for all design and test professionals as well as researchers and students working in the field. `A strength of this book is its breadth. Types of designs considered include analog and digital circuits, programmable logic arrays, and memories. Having a fault model does not automatically provide a test. Sometimes, design for testability hardware is necessary. Many design for testability ideas, supported by experimental evidence, are included.' ... from the Foreword by Vishwani D. Agrawal

Author: Kenneth P. Parker
Publisher: Springer Science & Business Media
ISBN: 0306476568
Category : Technology & Engineering
Languages : en
Pages : 307

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Book Description
Boundary-Scan, formally known as IEEE/ANSI Standard 1149.1-1990, is a collection of design rules applied principally at the Integrated Circuit (IC) level that allow software to alleviate the growing cost of designing, producing and testing digital systems. A fundamental benefit of the standard is its ability to transform extremely difficult printed circuit board testing problems that could only be attacked with ad-hoc testing methods into well-structured problems that software can easily deal with. IEEE standards, when embraced by practicing engineers, are living entities that grow and change quickly. The Boundary-Scan Handbook, Second Edition: Analog and Digital is intended to describe these standards in simple English rather than the strict and pedantic legalese encountered in the standards. The 1149.1 standard is now over eight years old and has a large infrastructure of support in the electronics industry. Today, the majority of custom ICs and programmable devices contain 1149.1. New applications for the 1149.1 protocol have been introduced, most notably the `In-System Configuration' (ISC) capability for Field Programmable Gate Arrays (FPGAs). The Boundary-Scan Handbook, Second Edition: Analog and Digital updates the information about IEEE Std. 1149.1, including the 1993 supplement that added new silicon functionality and the 1994 supplement that formalized the BSDL language definition. In addition, the new second edition presents completely new information about the newly approved 1149.4 standard often termed `Analog Boundary-Scan'. Along with this is a discussion of Analog Metrology needed to make use of 1149.1. This forms a toolset essential for testing boards and systems of the future.

Author: Amir Zjajo
Publisher: Springer Science & Business Media
ISBN: 9048197252
Category : Technology & Engineering
Languages : en
Pages : 311

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Book Description
With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. This has recently generated a great demand for low-power, low-voltage A/D converters that can be realized in a mainstream deep-submicron CMOS technology. However, the discrepancies between lithography wavelengths and circuit feature sizes are increasing. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. The inherent randomness of materials used in fabrication at nanoscopic scales means that performance will be increasingly variable, not only from die-to-die but also within each individual die. Parametric variability will be compounded by degradation in nanoscale integrated circuits resulting in instability of parameters over time, eventually leading to the development of faults. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. In an attempt to address these issues, Low-Power High-Resolution Analog-to-Digital Converters specifically focus on: i) improving the power efficiency for the high-speed, and low spurious spectral A/D conversion performance by exploring the potential of low-voltage analog design and calibration techniques, respectively, and ii) development of circuit techniques and algorithms to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover errors continuously. The feasibility of the described methods has been verified by measurements from the silicon prototypes fabricated in standard 180nm, 90nm and 65nm CMOS technology.

Author: J. Altet
Publisher: Springer Science & Business Media
ISBN: 1475736355
Category : Technology & Engineering
Languages : en
Pages : 212

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Book Description
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Author: Dimitris Gizopoulos
Publisher: Springer Science & Business Media
ISBN: 1402028016
Category : Computers
Languages : en
Pages : 226

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Book Description
Embedded Processor-Based Self-Test is a guide to self-testing strategies for embedded processors. Embedded processors are regularly used today in most System-on-Chips (SoCs). Testing of microprocessors and embedded processors has always been a challenge because most traditional testing techniques fail when applied to them. This is due to the complex sequential structure of processor architectures, which consists of high performance datapath units and sophisticated control logic for performance optimization. Structured Design-for-Testability (DfT) and hardware-based self-testing techniques, which usually have a non-trivial impact on a circuit’s performance, size and power, can not be applied without serious consideration and careful incorporation into the processor design. Embedded Processor-Based Self-Test shows how the powerful embedded functionality that processors offer can be utilized as a self-testing resource. Through a discussion of different strategies the book emphasizes on the emerging area of Software-Based Self-Testing (SBST). SBST is based on the idea of execution of embedded software programs to perform self-testing of the processor itself and its surrounding blocks in the SoC. SBST is a low-cost strategy in terms of overhead (area, speed, power), development effort and test application cost, as it is applied using low-cost, low-speed test equipment. Embedded Processor-Based Self-Test can be used by designers, DfT engineers, test practitioners, researchers and students working on digital testing, and in particular processor and SoC test. This book sets the framework for comparisons among different SBST methodologies by discussing key requirements. It presents successful applications of SBST to a number of embedded processors of different complexities and instruction set architectures.