International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) PDF Download

Author: Y. Obeng
Publisher: The Electrochemical Society
ISBN: 1607687135
Category :
Languages : en
Pages : 130

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Author: ASM International
Publisher: ASM International
ISBN: 1615030913
Category : Electronic apparatus and appliances
Languages : en
Pages : 551

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Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606

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Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author: Shichun Qu
Publisher: Springer
ISBN: 1493915568
Category : Technology & Engineering
Languages : en
Pages : 336

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Book Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Author:
Publisher:
ISBN: 9781607685210
Category :
Languages : en
Pages :

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Author: Ming Yang
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 688

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Book Description

Author: Abdoulaye Gamatié
Publisher: Springer
ISBN: 3319082396
Category : Technology & Engineering
Languages : en
Pages : 283

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Book Description
This book describes the trends, challenges and solutions in computing use for scientific research and development within different domains in Africa, such as health, agriculture, environment, economy, energy, education and engineering. The benefits expected are discussed by a number of recognized, domain-specific experts, with a common theme being computing as solution enabler. This book is the first document providing such a representative up-to-date view on this topic at the continent level.

Author: Chuan Seng Tan
Publisher: Springer Science & Business Media
ISBN: 0387765344
Category : Technology & Engineering
Languages : en
Pages : 365

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Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816

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Book Description

Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776

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Book Description