International Conference of Microelectronics--Microelectronics '92 PDF Download

Author: Andrzej Sowiński
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 672

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Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 776

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Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2264

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A world list of books in the English language.

Author: Vijay Nath
Publisher: Springer
ISBN: 9811082340
Category : Technology & Engineering
Languages : en
Pages : 834

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The volume presents high quality papers presented at the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017). The book discusses recent trends in technology and advancement in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes original papers based on original theoretical, practical, experimental, simulations, development, application, measurement, and testing. The applications and solutions discussed in the book will serve as a good reference material for future works.

Author: World Telecommunication Forum
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 44

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Author:
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ISBN:
Category : Research
Languages : en
Pages : 708

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Author:
Publisher: Information Gatekeepers Inc
ISBN:
Category :
Languages : en
Pages : 52

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Author: Vijay Nath
Publisher: Springer Nature
ISBN: 981155546X
Category : Technology & Engineering
Languages : en
Pages : 1078

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This book presents high-quality papers from the Fourth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2019). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.

Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 860

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Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250

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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.