Integrated Energy Efficient Silicon Modulators for Optical Interconnects PDF Download

Author: Seyedreza Hosseini
Publisher:
ISBN:
Category :
Languages : de
Pages :

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Author: Palmer, Robert
Publisher: KIT Scientific Publishing
ISBN: 3731503867
Category : Technology (General)
Languages : en
Pages : 250

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In this book, silicon photonic integrated circuits are combined with electro-optic organic materials for realizing energy-efficient modulators with unprecedented performance. These silicon-organic hybrid Mach-Zehnder modulators feature a compact size, sub-Volt drive voltages, and they support data rates up to 84 Gbit/s. In addition, a wet chemical waveguide fabrication scheme and an efficient fiber-chip coupling scheme are presented.

Author: Koji Yamada
Publisher: Frontiers Media SA
ISBN: 2889196933
Category : Engineering (General). Civil engineering (General)
Languages : en
Pages : 111

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Book Description
Silicon photonics technology, which has the DNA of silicon electronics technology, promises to provide a compact photonic integration platform with high integration density, mass-producibility, and excellent cost performance. This technology has been used to develop and to integrate various photonic functions on silicon substrate. Moreover, photonics-electronics convergence based on silicon substrate is now being pursued. Thanks to these features, silicon photonics will have the potential to be a superior technology used in the construction of energy-efficient cost-effective apparatuses for various applications, such as communications, information processing, and sensing. Considering the material characteristics of silicon and difficulties in microfabrication technology, however, silicon by itself is not necessarily an ideal material. For example, silicon is not suitable for light emitting devices because it is an indirect transition material. The resolution and dynamic range of silicon-based interference devices, such as wavelength filters, are significantly limited by fabrication errors in microfabrication processes. For further performance improvement, therefore, various assisting materials, such as indium-phosphide, silicon-nitride, germanium-tin, are now being imported into silicon photonics by using various heterogeneous integration technologies, such as low-temperature film deposition and wafer/die bonding. These assisting materials and heterogeneous integration technologies would also expand the application field of silicon photonics technology. Fortunately, silicon photonics technology has superior flexibility and robustness for heterogeneous integration. Moreover, along with photonic functions, silicon photonics technology has an ability of integration of electronic functions. In other words, we are on the verge of obtaining an ultimate technology that can integrate all photonic and electronic functions on a single Si chip. This e-Book aims at covering recent developments of the silicon photonic platform and novel functionalities with heterogeneous material integrations on this platform.

Author: David Patel
Publisher:
ISBN:
Category :
Languages : en
Pages :

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"Silicon photonics is a technology platform for integrating passive and active optical devices. The ability to use existing CMOS-VLSI foundry processes to fabricate integrated optics enables large volume production at low costs while maintaining compatibility with electronic integrated circuits. With the recent explosion in network traffic, large datacenters are demanding higher and higher intra-datacenter transmission speeds over distances of up to 20 km. For this application, optical interconnects are more energy efficient and are able to satisfy the bandwidth demands of the foreseeable future. Optical modulators are an essential component of these communication links and immense research is dedicated to developing efficient high bitrate devices. It is desirable to have high bitrate transmission over a single channel because it simplifies multiplexing (e.g., fewer wavelengths and parallel fibers) which can increase costs. The work presented in this thesis uses the silicon photonic platform to realize an integrated Mach-Zehnder modulator (MZM) suitable for datacenter communication links.A series push-pull traveling wave MZM is designed using T-shaped extensions to increase the microwave index. The modulator is designed to have a characteristic impedance close to 50 Ohms for matching with common microwave drivers and terminations. In addition, the group velocities of the microwave and optical wave are closely matched to optimize the electro-optic bandwidth. A 37 GHz -3 dB electro-optic bandwidth was measured at 1 V reverse bias. The DC Vpi was measured to be 7 V in the most efficient arm, corresponding to a VpiLpi of 2.8 V-cm. For on-off keying modulation, open eye diagrams are visible up to 60 Gbps. Error-free operation with a bit error rate (BER)

Author: Madeleine Glick
Publisher: Elsevier
ISBN: 032391831X
Category : Technology & Engineering
Languages : en
Pages : 523

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Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks

Author: Yiwen Rong
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 116

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Book Description
Information processing requires interconnects to carry information from one place to another. Optical interconnects between electronics systems have attracted significant attention and development for a number of years because optical links have demonstrated potential advantages for high-speed, low-power, and interference immunity. With increasing system speed and greater bandwidth requirements, the distance over which optical communication is useful has continually decreased to chip-to-chip and on-chip levels. Monolithic integration of photonics and electronics will significantly reduce the cost of optical components and further combine the functionalities of chips on the same or different boards or systems. Modulators are one of the fundamental building blocks for optical interconnects. Previous work demonstrated modulators based upon the quantum confined Stark effect (QCSE) in SiGe p-i-n devices with strained Ge/SiGe multi-quantum-well (MQW) structures in the i region. While the previous work demonstrated the effect, it did not examine the high-speed aspects of the device, which is the focus of this dissertation. High-speed modulation and low driving voltage are the keys for the device's practical use. At lower optical intensity operation, the ultimate limitation in speed will be the RC time constant of the device itself. At high optical intensity, the large number of photo generated carriers in the MQW region will limit the performance of the device through photo carrier related voltage drop and exciton saturation. In previous work, the devices consist of MQWs configured as p-i-n diodes. The electric field induced absorption change by QCSE modulates the optical transmission of the device. The focus of this thesis is the optimization of MQW material deposition, minimization of the parasitic capacitance of the probe pads for high speed, low voltage and high contrast ratio operation. The design, fabrication and high-speed characterization of devices of different sizes, with different bias voltages are presented. The device fabrication is based on processes for standard silicon electronics and is suitable for mass-production. This research will enable efficient transceivers to be monolithically integrated with silicon chips for high-speed optical interconnects. We demonstrated a modulator, with an eye diagram of 3.125GHz, a small driving voltage of 2.5V and an f3dB bandwidth greater than 30GHz. Carrier dynamics under ultra-fast laser excitation and high-speed photocurrent response are also investigated.

Author: Chenghao Feng
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

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Integrated photonics is a promising technology for next-generation computing because of the essential characteristics of light, including low latency, high bandwidth, and low power consumption. In the past decades, Integrated photonics has evolved significantly over the past few decades, with abundant passive and active optical components offering ultrahigh bandwidth and ultralow power consumption. In addition, advancements in fabrication technologies have also enabled the co-integration of silicon-based electronic and photonic circuits on a chip, allowing for the realization of complex computing tasks with electrons and photons. Previous work reveals that photonic-electronic computing circuits have the potential to outperform transistor-based electronic computing circuits by orders of magnitude in speed and energy efficiency. However, the scalability of photonic-electronic circuits still requires improvement, which is critical to the success of optical computing in the post-Moore’s law era, especially given the need for this technology to compete with other emerging computing technologies. This dissertation proposes the development of scalable photonic-electronic integrated circuits that capitalize on the strengths of electrons and photons to facilitate high-speed, energy-efficient computing and intra-chip interconnects. We explore scaling technologies for photonic computing systems that optimize the area and energy efficiency, such as wavelength division multiplexing (WDM), and demonstrate their effectiveness through experimental demonstrations. Our investigation of photonic-electronic computing circuits spans from the device to the architecture level and includes both digital and analog computing. We first introduce the building blocks of optical computing, including essential components like electro-optic modulators, and discuss general scaling technologies in silicon-based photonic-electronic computing circuit designs. We then present a WDM-based photonic-electronic digital comparator with experimental demonstrations that exhibit its practicality in performing high-performance arithmetic logic operations. Next, we investigate photonic-electronic circuits for intra-chip interconnect with a WDM-based photonic-electronic switching network. These photonic-electronic digital logic circuits can be operated at 20 Gb/s with experimental demonstrations. Additionally, we focus on optical analog computing and discuss scaling strategies for photonic-electronic analog computing circuits that can accelerate artificial intelligence (AI) tasks. We present a subspace optical neural network architecture that trades the universality of weight representation for better hardware usage, such as a smaller footprint and lower energy consumption. We experimentally demonstrate its utility using a butterfly-style photonic-electronic neural chip. Finally, we investigate device-level optimization of the optical neural network using a promising multi-operand optical neuron to further scale down the footprint of photonic neural chips. We conduct thorough performance discussions of these photonic-electronic computing circuits, demonstrating their potential to outperform transistor-based computing circuits in terms of computational speed and energy efficiency

Author: Ian O'Connor
Publisher: Springer Science & Business Media
ISBN: 1441961933
Category : Technology & Engineering
Languages : en
Pages : 286

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Book Description
This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.

Author: Erman Timurdogan
Publisher:
ISBN:
Category :
Languages : en
Pages : 180

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Book Description
Silicon photonics is an emerging platform that promises to revolutionize integrated optics. This is expected to happen by inheriting the cost-effective, very large scale integration capabilities from complementary metal-oxide-semiconductor (CMOS) process. The compatibility with CMOS also merges the electronics and photonics world in a single platform. While electronics are key for computations, photonics are key for communications. While the computations within a micro-processor was scaling, the communication scaling was limited by high-cost and high-power optical interconnects. The communication bottlenecks in micro-processors, data-centers, super-computers and tele-communications industry indicated a challenge for energy-efficient and low power optical interconnects for the last decade. This challenge have produced preliminary key silicon photonics components, including on-chip lasers, low-loss silicon waveguides, high-speed silicon modulators and detectors. However, the holistic approach was not used for addressing the needs for photonic components, photonics and electronics integration. Here, we demonstrate two major breakthroughs. First one is an ultralow power intrachip electronic-photonic link. This photonic link required to find efficient ways to realize active photonic filters, modulators, transmitters, detectors and receivers that operate with close to single femtojoule energy while tackling wafer-scale fabrication and thermal variations. To integrate these photonics components with electronics with little to no excess energy consumption, a seamless interface between electronics and photonics wafers was introduced, through-oxide-vias (TOVs). When the electronic-photonic integration was complete with TOVs, a communication link that operate at 5Gb/s with an energy consumption as low as 250fJ/bit, is demonstrated. Second, second-order nonlinear effects were missing in silicon due to its crystalline symmetry. The crystalline symmetry of silicon is broken with an applied DC field, generating second-order nonlinear susceptibility in CMOS compatible silicon photonics platform. The field induced second-order nonlinear effects are demonstrated in the form of DC Kerr effect and second harmonic generation in silicon.

Author: Md Hai
Publisher:
ISBN:
Category :
Languages : en
Pages :

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"The increasing number of computational servers in the data centers is imposing tighter constraints on the networking infrastructure. Conventional dense electronic integration introduces large RC delay, latency, jitter and leads to high power consumption, that increases the operational cost of the data center network. Optical interconnects can address some of the challenges to improve the power efficiency, bandwidth capacity and scalability of the physical layer in the data center network. Therefore, scalable power efficient optical interconnect network becomes necessary to leverage the bandwidth capacity of current electronic switches or opto-electronic components. Novel optical interconnect technology can enhance the network capacity by harnessing the feasibility of simultaneous processing of optical signal in the wavelength and time domains. Therefore, extensive research to design and characterize the optical components on photonic integrated circuits (PICs) is going on to build the optical interconnects that will meet the ever increasing bandwidth demand. Propagation loss of the integrated optical waveguide is one of the key challenges to design optical components that requires large time delay to implement functionalities such as buffering, time division multiplexing. For example, conventional InP and silicon waveguides exhibit 1.5 dB/cm and 2.5 dB/cm propagation loss, respectively. InP or silicon waveguide based optical buffers will suffer from more than 100 dB loss to implement just ~10 ns time delay. Therefore it is important to investigate the possibility of using a low-loss integrated waveguides to build photonic circuit that requires long optical buffers. In this thesis, we present two photonic components designed on a low-loss Si3N4 waveguide platform : a thermally tunable 1 x 4 channel wavelength demultiplexer and a four channel passive wavelength-striped mapping (PWSM) device. We have also proposed an optical time sampling based photoreceiver and a ring-based 25 Gb/s DAC-less reverse biased PAM-4 modulator. The latter two devices are designed on the silicon photonicsplatform. The design and characterization result of these two devices are presented brieflyin this thesis. The thermally tunable 1 x 4 channel optical demultiplexer is designed using an ultra low-loss Si3N4 (propagation loss ~3.1 dB/m) waveguide. The demultiplexer has three 2 x 2 Mach-Zehnder interferometers (MZI), where each of the MZIs contains two 2 x 2 general-interference-based multimode interference (MMI) couplers. The Chromium (Cr) heaters placed on the delay arms of the MZI filters enablethermal tuning to control the optical phase shift in the MZI delay arms. This facilitates achieving moderately low crosstalk (14.5 dB) between the adjacent channels after optical filtering. Error free performance (bit error rate (BER) of 1x10^-12) is obtained for all the four 40 Gb/sec data rate channels. Next, we present the four channel optical PWSM device, which passively time compresses/expands serial packets through optical wavelength multiplexing/demultiplexing. The PWSM device, which has a 1 x 4 channel optical wavelength demultiplexer with integrated optical delay lines, is also designed in the low-loss Si3N4 waveguide platform. The PWSM device multiplexes/demultiplexes four wavelength division multiplexed (WDM) channels and offsets in time the adjacent channels to optically serialize/de-serialize the datapackets. In this demonstration, a 64 ns long data packet is formed at the output of the device by combining four 16 ns data segments of the packet in the time domain. We have measured a bit error rate (BER) performance below 1 x 10^-9 for the 64 ns serial data packet regenerated by the PWSM device for a received optical power of -6.7 dBm.In addition to these two components, a novel photoreceiver architecture enabling parallelprocessing of a high-speed optical signal in the electronic domain is demonstrated using SiGephotodetectors. " --