Integrated Circuit Design and Technology PDF Download

Author: M. J. Morant
Publisher: Springer
ISBN: 148997198X
Category : Technology & Engineering
Languages : en
Pages : 199

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Book Description

Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1420007955
Category : Technology & Engineering
Languages : en
Pages : 608

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Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Author: E. Wolfendale
Publisher: Elsevier
ISBN: 1483102491
Category : Technology & Engineering
Languages : en
Pages : 129

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Book Description
MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit design.

Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 144190784X
Category : Technology & Engineering
Languages : en
Pages : 292

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Book Description
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Author: Peter Shepherd
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 248

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Book Description
All aspects of chip realization for both digital and analog circuits are covered. Electronics engineers are shown how to choose appropriate technololgy and circuit architecture, and plan the IC design. They'll gain expert information on power consaiderations, the advantages and disadvantages of each IC architecture, and aspects of design for testability.

Author: Tertulien Ndjountche
Publisher: CRC Press
ISBN: 0429850409
Category : Technology & Engineering
Languages : en
Pages : 1176

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Book Description
High-speed, power-efficient analog integrated circuits can be used as standalone devices or to interface modern digital signal processors and micro-controllers in various applications, including multimedia, communication, instrumentation, and control systems. New architectures and low device geometry of complementary metaloxidesemiconductor (CMOS) technologies have accelerated the movement toward system on a chip design, which merges analog circuits with digital, and radio-frequency components.

Author: Mikael Sahrling
Publisher: Cambridge University Press
ISBN: 1108498450
Category : Computers
Languages : en
Pages : 257

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Book Description
Learn how to use estimation techniques to solve real-world IC design problems and accelerate design processes with this practical guide.

Author: David A. Hodges
Publisher: McGraw-Hill Incorporated
ISBN: 9780071181648
Category : Digital integrated circuits
Languages : en
Pages : 580

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Book Description
The third edition of Hodges and Jackson’s Analysis and Design of Digital Integrated Circuits has been thoroughly revised and updated by a new co-author, Resve Saleh of the University of British Columbia. The new edition combines the approachability and concise nature of the Hodges and Jackson classic with a complete overhaul to bring the book into the 21st century. The new edition has replaced the emphasis on BiPolar with an emphasis on CMOS. The outdated MOS transistor model used throughout the book will be replaced with the now standard deep submicron model. The material on memory has been expanded and updated. As well the book now includes more on SPICE simulation and new problems that reflect recent technologies. The emphasis of the book is on design, but it does not neglect analysis and has as a goal to provide enough information so that a student can carry out analysis as well as be able to design a circuit. This book provides an excellent and balanced introduction to digital circuit design for both students and professionals.

Author: Mark Rodwell
Publisher: World Scientific
ISBN: 9814490938
Category : Technology & Engineering
Languages : en
Pages : 372

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Book Description
This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.