Author: Haojun LuoPublisher:
ISBN:
Category :
Languages : en
Pages : 155
Book Description
Amorphous Indium Gallium Zinc Oxide Based Thin Film Transistors and Circuits
Author: Haojun LuoFabrication of Amorphous Indium Gallium Zinc Oxide Thin Film Transistors by Focused Ion Beam
Author: Wencong ZhuReliability and Physical Mechanisms of Amorphous Indium Gallium Zinc Oxide Thin-Film Transistors for Advanced Display
Author: Amorphous Oxide Semiconductors
Author: Hideo HosonoPublisher: John Wiley & Sons
ISBN: 1119715652
Category : Technology & Engineering
Languages : en
Pages : 644
Book Description
AMORPHOUS OXIDE SEMICONDUCTORS A singular resource on amorphous oxide semiconductors edited by a world-recognized pioneer in the field In Amorphous Oxide Semiconductors: IGZO and Related Materials for Display and Memory, the Editors deliver a comprehensive account of the current status of—and latest developments in—transparent oxide semiconductor technology. With contributions from leading international researchers and exponents in the field, this edited volume covers physical fundamentals, thin-film transistor applications, processing, circuits and device simulation, display and memory applications, and new materials relevant to amorphous oxide semiconductors. The book makes extensive use of structural diagrams of materials, energy level and energy band diagrams, device structure illustrations, and graphs of device transfer characteristics, photographs and micrographs to help illustrate the concepts discussed within. It also includes: A thorough introduction to amorphous oxide semiconductors, including discussions of commercial demand, common challenges faced during their manufacture, and materials design Comprehensive explorations of the electronic structure of amorphous oxide semiconductors, structural randomness, doping limits, and defects Practical discussions of amorphous oxide semiconductor processing, including oxide materials and interfaces for application and solution-process metal oxide semiconductors for flexible electronics In-depth examinations of thin film transistors (TFTs), including the trade-off relationship between mobility and reliability in oxide TFTs Perfect for practicing scientists, engineers, and device technologists working with transparent semiconductor systems, Amorphous Oxide Semiconductors: IGZO and Related Materials for Display and Memory will also earn a place in the libraries of students studying oxides and other non-classical and innovative semiconductor devices. WILEY SID Series in Display Technology Series Editor: Ian Sage, Abelian Services, Malvern, UK The Society for Information Display (SID) is an international society which has the aim of encouraging the development of all aspects of the field of information display. Complementary to the aims of the society, the Wiley-SID series is intended to explain the latest developments in information display technology at a professional level. The broad scope of the series addresses all facets of information displays from technical aspects through systems and prototypes to standards and ergonomics.
Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO
Author: Shunpei YamazakiPublisher: John Wiley & Sons
ISBN: 1119247349
Category : Technology & Engineering
Languages : en
Pages : 377
Book Description
This book describes the application of c-axis aligned crystalline In-Ga-Zn oxide (CAAC-IGZO) technology in large-scale integration (LSI) circuits. The applications include Non-volatile Oxide Semiconductor Random Access Memory (NOSRAM), Dynamic Oxide Semiconductor Random Access Memory (DOSRAM), central processing unit (CPU), field-programmable gate array (FPGA), image sensors, and etc. The book also covers the device physics (e.g., off-state characteristics) of the CAAC-IGZO field effect transistors (FETs) and process technology for a hybrid structure of CAAC-IGZO and Si FETs. It explains an extremely low off-state current technology utilized in the LSI circuits, demonstrating reduced power consumption in LSI prototypes fabricated by the hybrid process. A further two books in the series will describe the fundamentals; and the specific application of CAAC-IGZO to LCD and OLED displays. Key features: • Outlines the physics and characteristics of CAAC-IGZO FETs that contribute to favorable operations of LSI devices. • Explains the application of CAAC-IGZO to LSI devices, highlighting attributes including low off-state current, low power consumption, and excellent charge retention. • Describes the NOSRAM, DOSRAM, CPU, FPGA, image sensors, and etc., referring to prototype chips fabricated by a hybrid process of CAAC-IGZO and Si FETs.
Fabrication and Analysis of Indium Gallium Zinc Oxide Transparent Thin Film Transistors
Author: 蘇鵬宇Passivation of Amorphous Indium-gallium-zinc Oxide (IGZO) Thin-film Transistors
Author: Nathaniel WalshPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 90
Book Description
"Thin-film transistors (TFTs) with channel materials made out of hydrogenated amorphous silicon (a-Si:H) and polycrystalline silicon (poly-Si) have been extensively investigated. Amorphous silicon continues to dominate the large-format display technology; however newer technologies demand a higher performance TFT which a-Si:H cannot deliver due to its low electron mobility, μn ~ 1 cm2/V*s. Metal-oxide materials such as Indium-Gallium-Zinc Oxide (IGZO) have demonstrated semiconductor properties, and are candidates to replace a Si:H for TFT backplane technologies. This work involves the fabrication and characterization of TFTs utilizing a-IGZO deposited by RF sputtering. An overview of the process details and results from recently fabricated IGZO TFTs following designed experiments are presented, followed by analysis of electrical results. The investigated process variables were the thickness of the IGZO channel material, passivation layer material, and annealing conditions. The use of electron-beam deposited Aluminum oxide (alumina or Al2O3) as back-channel passivation material resulted in improved device stability; however ID VG transfer characteristics revealed the influence of back-channel interface traps. Results indicate that an interaction effect between the annealing condition (time/temperature) and the IGZO thickness on the electrical behavior of alumina-passivated devices may be significant. A device model implementing fixed charge and donor-like interface traps that are consistent with oxygen vacancies (OV) resulted in a reasonable match to measured characteristics. Modified annealing conditions have resulted in a reduction of back-channel interface traps, with levels comparable to devices fabricated without the addition of passivation material."--Abstract.
Author: Arun Suresh
Author: 吳昱陞
Author: