Author: Norman J. ElliottPublisher:
ISBN:
Category : Static relays
Languages : en
Pages : 20
Book Description
A method for improving transistor switching characteristics at elevated temperatures is suggested, with test circuits and results.
Improving Transistor Switching at Elevated Temperatures Without the Use of Reverse Bias
Author: Norman J. ElliottPublisher:
ISBN:
Category : Static relays
Languages : en
Pages : 20
Book Description
A method for improving transistor switching characteristics at elevated temperatures is suggested, with test circuits and results.
Nuclear Science Abstracts
Author: Public Releases Through 1963
Author: Sandia Corporation Bibliography
Author: U.S. Government Research Reports
Author: Civilian Application Releases Through 1962
Author: Atomic Energy Research Reports for Sale by the U.S. Department of Commerce, Office of Technical Services
Author: Business and Defense Services AdministrationPublisher:
ISBN:
Category :
Languages : en
Pages : 68
Book Description
2024-25 RRB ALP Stage-II Technician Electronics Mechanic Solved Papers
Author: YCT Expert Team Publisher: YOUTH COMPETITION TIMES
ISBN:
Category : Antiques & Collectibles
Languages : en
Pages : 786
Book Description
2024-25 RRB ALP Stage-II Technician Electronics Mechanic Solved Papers 784 1495 E. This book contains 129 previous solved papers and 8181 OQ.
Sustainable ICTs and Management Systems for Green Computing
Author: Hu, Wen-ChenPublisher: IGI Global
ISBN: 146661840X
Category : Business & Economics
Languages : en
Pages : 496
Book Description
"This book focuses on information technology using sustainable green computing to reduce energy and resources used"--Provided by publisher.
Materials for High-Temperature Semiconductor Devices
Author: National Research CouncilPublisher: National Academies Press
ISBN: 0309176050
Category : Technology & Engineering
Languages : en
Pages : 135
Book Description
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.