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NIST Serial Holdings

NIST Serial Holdings PDF Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 268

Book Description

NIST Serial Holdings

NIST Serial Holdings PDF Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 268

Book Description

Parts Selection and Management

Parts Selection and Management PDF Author: Michael Pecht
Publisher: John Wiley & Sons
ISBN: 0471723878
Category : Technology & Engineering
Languages : en
Pages : 351

Book Description
Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.

Argonne List of Serials

Argonne List of Serials PDF Author: Argonne National Laboratory. Library Services Department
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 344

Book Description

Catalog of Copyright Entries

Catalog of Copyright Entries PDF Author: Library of Congress. Copyright Office
Publisher:
ISBN:
Category : Copyright
Languages : en
Pages : 718

Book Description

Catalogue of Title-entries of Books and Other Articles Entered in the Office of the Librarian of Congress, at Washington, Under the Copyright Law ... Wherein the Copyright Has Been Completed by the Deposit of Two Copies in the Office

Catalogue of Title-entries of Books and Other Articles Entered in the Office of the Librarian of Congress, at Washington, Under the Copyright Law ... Wherein the Copyright Has Been Completed by the Deposit of Two Copies in the Office PDF Author: Library of Congress. Copyright Office
Publisher:
ISBN:
Category : American drama
Languages : en
Pages : 1510

Book Description

Reliability Abstracts and Technical Reviews

Reliability Abstracts and Technical Reviews PDF Author:
Publisher:
ISBN:
Category : Reliability (Engineering)
Languages : en
Pages : 512

Book Description

Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability PDF Author: Dongkai Shangguan
Publisher: ASM International
ISBN: 161503093X
Category : Technology & Engineering
Languages : en
Pages : 292

Book Description

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design PDF Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Software Engineering with Reusable Components

Software Engineering with Reusable Components PDF Author: Johannes Sametinger
Publisher: Springer Science & Business Media
ISBN: 3662033453
Category : Computers
Languages : en
Pages : 275

Book Description
The book provides a clear understanding of what software reuse is, where the problems are, what benefits to expect, the activities, and its different forms. The reader is also given an overview of what sofware components are, different kinds of components and compositions, a taxonomy thereof, and examples of successful component reuse. An introduction to software engineering and software process models is also provided.

3D Microelectronic Packaging

3D Microelectronic Packaging PDF Author: Yan Li
Publisher: Springer
ISBN: 3319445863
Category : Technology & Engineering
Languages : en
Pages : 465

Book Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
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