IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Download

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 194

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Author: Walt Trybula
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 370

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Author: Yash Agrawal
Publisher: Springer Nature
ISBN: 9819944767
Category : Technology & Engineering
Languages : en
Pages : 286

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This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Author: Preeti S Chauhan
Publisher: Springer Science & Business Media
ISBN: 1461457610
Category : Technology & Engineering
Languages : en
Pages : 254

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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Author: John J. Stephens
Publisher: ASM International
ISBN: 1615031170
Category : Technology & Engineering
Languages : en
Pages : 430

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Author: Nishar Hameed
Publisher: Elsevier
ISBN: 0323985351
Category : Technology & Engineering
Languages : en
Pages : 301

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Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends

Author: EUROFORUM Deutschland GmbH
Publisher: Springer Nature
ISBN: 3662588668
Category : Technology & Engineering
Languages : en
Pages : 368

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Every year, the international transmission and drive community meets up at the International CTI SYMPOSIA – automotive drivetrains, intelligent, electrified – in Germany, China and USA to discuss the best strategies and technologies for tomorrow’s cars, busses and trucks. From efficiency, comfort or costs to electrification, energy storage and connectivity, these premier industry meetings cover all the key issues in depth.

Author: Shuo-Yan Chou
Publisher: Springer Science & Business Media
ISBN: 1848827628
Category : Technology & Engineering
Languages : en
Pages : 877

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Global Perspective for Competitive Enterprise, Economy and Ecology addresses the general theme of the Concurrent Engineering (CE) 2009 Conference – the need for global advancements in the areas of competitive enterprise, economy and ecology. The proceedings contain 84 papers, which vary from the theoretical and conceptual to the practical and industrial. The content of this volume reflects the genuine variety of issues related to current CE methods and phenomena. Global Perspective for Competitive Enterprise, Economy and Ecology will therefore enable researchers, industry practitioners, postgraduate students and advanced undergraduates to build their own view of the inherent problems and methods in CE.

Author: Mohd Mustafa Al Bakri Abdullah
Publisher: Trans Tech Publications Ltd
ISBN: 3035730202
Category : Technology & Engineering
Languages : en
Pages : 624

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Book Description
Selected peer reviewed papers from the 2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan