Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 420
Book Description
IEEE/CPMT International Electronics Manufacturing Technology Symposium
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 420
Book Description
IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings].
![IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF](https://books.google.com/books/content/images/frontcover/4wlWAAAAMAAJ?fife=w80-h100)
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 194
Book Description
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA
Author: Walt TrybulaPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536
Book Description
Handbook of Wafer Bonding
Author: Peter RammPublisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435
Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA
Author: Don MillardPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Ball grid array technology
Languages : en
Pages : 504
Book Description
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Physical Assurance
Author: Navid AsadizanjaniPublisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193
Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Brazing and Soldering
Author: John J. StephensPublisher: ASM International
ISBN: 1615031170
Category : Technology & Engineering
Languages : en
Pages : 430
Book Description
Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
Author: Albert BlodgettPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780314245
Category : Technology & Engineering
Languages : en
Pages : 504
Book Description
'Advances in Microelectronics: Reviews', Vol_1
Author: Sergey YurishPublisher: Lulu.com
ISBN: 8469786334
Category : Technology & Engineering
Languages : en
Pages : 536
Book Description
The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.
Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) LiPublisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.