IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Download

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 194

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Author: Walt Trybula
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 370

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Author: Nishar Hameed
Publisher: Elsevier
ISBN: 0323985351
Category : Technology & Engineering
Languages : en
Pages : 301

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Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends

Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435

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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Author: EUROFORUM Deutschland GmbH
Publisher: Springer Nature
ISBN: 3662588668
Category : Technology & Engineering
Languages : en
Pages : 368

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Every year, the international transmission and drive community meets up at the International CTI SYMPOSIA – automotive drivetrains, intelligent, electrified – in Germany, China and USA to discuss the best strategies and technologies for tomorrow’s cars, busses and trucks. From efficiency, comfort or costs to electrification, energy storage and connectivity, these premier industry meetings cover all the key issues in depth.

Author: Alan T. Zehnder
Publisher: Springer
ISBN: 3319421956
Category : Science
Languages : en
Pages : 155

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Fracture, Fatigue, Failure and Damage Evolution, Volume 8 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the eighth volume of ten from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: In-situ Techniques for Fracture & Fatigue General Topics in Fracture & Fatigue Fracture & Fatigue of Composites Damage, Fracture, Fatigue & Durability Interfacial Effects in Fracture & Fatigue Damage Detection in Fracture & Fatigue

Author: John D. Cressler
Publisher: CRC Press
ISBN: 143987431X
Category : Technology & Engineering
Languages : en
Pages : 1041

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Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Author: John J. Stephens
Publisher: ASM International
ISBN: 1615031170
Category : Technology & Engineering
Languages : en
Pages : 430

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Author: Erlend Alfnes
Publisher: Springer Nature
ISBN: 3031436628
Category : Computers
Languages : en
Pages : 842

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Book Description
This 4-volume set, IFIP AICT 689-692, constitutes the refereed proceedings of the International IFIP WG 5.7 Conference on Advances in Production Management Systems, APMS 2023, held in Trondheim, Norway, during September 17–21, 2023. The 213 full papers presented in these volumes were carefully reviewed and selected from a total of 224 submissions. They were organized in topical sections as follows: Part I : Lean Management in the Industry 4.0 Era; Crossroads and Paradoxes in the Digital Lean Manufacturing World; Digital Transformation Approaches in Production Management; Managing Digitalization of Production Systems; Workforce Evolutionary Pathways in Smart Manufacturing Systems; Next Generation Human-Centered Manufacturing and Logistics Systems for the Operator 5.0; and SME 5.0: Exploring Pathways to the Next Level of Intelligent, Sustainable, and Human-Centered SMEs. Part II : Digitally Enabled and Sustainable Service and Operations Management in PSS Lifecycle; Exploring Digital Servitization in Manufacturing; Everything-as-a-Service (XaaS) Business Models in the Manufacturing Industry; Digital Twin Concepts in Production and Services; Experiential Learning in Engineering Education; Lean in Healthcare; Additive Manufacturing in Operations and Supply Chain Management; and Applications of Artificial Intelligence in Manufacturing. Part III : Towards Next-Generation Production and SCM in Yard and Construction Industries; Transforming Engineer-to-Order Projects, Supply Chains and Ecosystems; Modelling Supply Chain and Production Systems; Advances in Dynamic Scheduling Technologies for Smart Manufacturing; and Smart Production Planning and Control. Part IV : Circular Manufacturing and Industrial Eco-Efficiency; Smart Manufacturing to Support Circular Economy; Product Information Management and Extended Producer Responsibility; Product and Asset Life Cycle Management for Sustainable and Resilient Manufacturing Systems; Sustainable Mass Customization in the Era of Industry 5.0; Food and Bio-Manufacturing; Battery Production Development and Management; Operations and SCM in Energy-Intensive Production for a Sustainable Future; and Resilience Management in Supply Chains.