IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Download

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 470

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Author: IEMT
Publisher:
ISBN: 9780780366213
Category : Technology & Engineering
Languages : en
Pages : 388

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Author: Fabio Giudice
Publisher: CRC Press
ISBN: 1420001043
Category : Science
Languages : en
Pages : 517

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In recent years the increased awareness of environmental issues has led to the development of new approaches to product design, known as Design for Environment and Life Cycle Design. Although still considered emerging and in some cases radical, their principles will become, by necessity, the wave of the future in design. A thorough exploration of t

Author: Jan S. Iwanczyk
Publisher: CRC Press
ISBN: 149876682X
Category : Technology & Engineering
Languages : en
Pages : 331

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Radiation Detectors for Medical Imaging discusses the current state of the art and future prospects of photon-counting detectors for medical imaging applications. Featuring contributions from leading experts and pioneers in their respective fields, this book:Describes x-ray spectral imaging detectors based on cadmium zinc telluride (CdZnTe) and cad

Author: Yoon Seok Chang
Publisher: Springer Science & Business Media
ISBN: 1402078129
Category : Business & Economics
Languages : en
Pages : 525

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In the last half of the twentieth century industry encountered a revolutionary change brought about by the harnessed power of seemingly ever-increasing capacity, speed and functionality of computers and microprocessors. This strength provided management and workers within industries with new capabilities for management, planning and control, design, quality assurance and customer support. Organized information flow became the mainstay of industrial companies. New tools and information technology systems emerged and evolved to enable companies to integrate the various departments (Design, Procurement, Manufacturing, Sales and Finance) within companies, particularly the lager ones, including international corporations. This was to give them a chance to meet new demands for product time to market, just in time supply of orders, and customer support. To the smaller company these changes were not so apparent. Neither the tools nor systems nor indeed their economic value seemed appropriate to them except for special cases. While all this was happening the structure of the larger companies began to disintegrate. Strong competitive pressures and globalization of the market place brought this about. Shedding unwanted competence and subcontracting it to others became common practice. Regional market pressures triggered companies to reorganize to create, produce, and distribute goods and services. Greater dependency on chains of supply from external companies became the norm. Medium and smaller sized companies began to gain some advantage and at the same time some were sucked into management and control systems governed by the larger companies.

Author: Mark Tehranipoor
Publisher: Springer Nature
ISBN: 3030644480
Category : Technology & Engineering
Languages : en
Pages : 602

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This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.

Author: YongAn Huang
Publisher: Springer
ISBN: 981133627X
Category : Technology & Engineering
Languages : en
Pages : 297

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9811209634
Category : Packaging
Languages : en
Pages : 1079

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Book Description
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Author: Pedro Costa
Publisher: Woodhead Publishing
ISBN: 0128185023
Category : Technology & Engineering
Languages : en
Pages : 552

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Book Description
Advanced Lightweight Multifunctional Materials presents the current state-of-the-art on multifunctional materials research, focusing on different morphologies and their preparation and applications. The book emphasizes recent advances on these types of materials as well as their application. Chapters cover porous multifunctional materials, thermochromic and thermoelectric materials, shape memory materials, piezoelectric multifunctional materials, electrochromic and electrorheological, soft materials, magnetic and photochromic materials, and more. The book will be a valuable reference resource for academic researchers and industrial engineers working in the design and manufacture of multifunctional materials, composites and nanocomposites. - Provides detailed information on design, modeling and structural applications - Focuses on characteristics, processing, design and applications - Discusses the main types of lightweight multifunctional materials and processing techniques, as well as the physico-chemical insights that can lead to improved performance

Author: Peng Cao
Publisher: Elsevier
ISBN: 0323907628
Category : Technology & Engineering
Languages : en
Pages : 540

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Book Description
Advanced Ceramics for Energy Storage, Thermoelectrics and Photonics describes recent progress in ceramic synthesis and applications in the areas of rechargeable batteries, capacitors, fuel cells, ferroelectrics, thermoelectrics, and inorganic luminescence materials. Both fundamental scientific advancements and technological breakthroughs in terms of new ceramic chemistries, new synthesis methodologies, and new applications are discussed in detail. The latest developments in advanced electrodes, ionic conductors, catalysts, thermoelectric ceramics, and luminescent powders/ceramics and their applications are also covered. With its focus on energy-related applications, the book will be a valuable reference resource for new researchers, academics, and postgraduate students who are interested in delving deeper into energy-related materials research, in particular, the areas of electronic and optical ceramics and their potential applications. - Covers three key areas of ceramics science: electrochemical energy conversion, thermoelectrics, and photonics - An entire section that explains the fundamental theory that lies behind new ceramic chemistries and synthesis methodologies - Complex perspectives are explained, such as solid electrolytes and the coupling between thermal and electric phenomena and optical properties as well as electrodes, ionic conductors, catalysts, thermoelectric ceramics and their applications - Discusses challenges that new ceramic technology is currently facing and the potential solutions for commercial success