IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Download

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 194

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 470

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Author: Walt Trybula
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536

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Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566771368
Category : Technology & Engineering
Languages : en
Pages : 366

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Author: Electronic Device Failure Analysis Society
Publisher: ASM International
ISBN: 1615030891
Category : Technology & Engineering
Languages : en
Pages : 524

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Book Description

Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416

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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490

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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Author: Shen Liu
Publisher: John Wiley & Sons
ISBN: 0470828412
Category : Technology & Engineering
Languages : en
Pages : 586

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Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Author: Jia-Wei Chang
Publisher: Springer Nature
ISBN: 9811601151
Category : Technology & Engineering
Languages : en
Pages : 2343

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This book gathers the proceedings of the 10th International Conference on Frontier Computing, held in Singapore, on July 10–13, 2020, and provides comprehensive coverage of the latest advances and trends in information technology, science, and engineering. It addresses a number of broad themes, including communication networks, business intelligence and knowledge management, web intelligence, and related fields that inspire the development of information technology. The respective contributions cover a wide range of topics: database and data mining, networking and communications, web and Internet of things, embedded systems, soft computing, social network analysis, security and privacy, optical communication, and ubiquitous/pervasive computing. Many of the papers outline promising future research directions, and the book benefits students, researchers, and professionals alike. Further, it offers a useful reference guide for newcomers to the field.

Author: Alexandre Dolgui
Publisher: Elsevier
ISBN: 0080478484
Category : Technology & Engineering
Languages : en
Pages : 839

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Book Description
Information Control Problems in Manufacturing 2006 contains the Proceedings of the 12th IFAC Symposium on Information Control Problems in Manufacturing (INCOM'2006). This symposium took place in Saint Etienne, France, on May 17-19 2006. INCOM is a tri-annual event of symposia series organized by IFAC and it is promoted by the IFAC Technical Committee on Manufacturing Plant Control. The purpose of the symposium INCOM'2006 was to offer a forum to present the state-of-the-art in international research and development work, with special emphasis on the applications of optimisation methods, automation and IT technologies in the control of manufacturing plants and the entire supply chain within the enterprise. The symposium stressed the scientific challenges and issues, covering the whole product and processes life cycle, from the design through the manufacturing and maintenance, to the distribution and service. INCOM'2006 Technical Program also included a special event on Innovative Engineering Techniques in Healthcare Delivery. The application of engineering and IT methods in medicine is a rapidly growing field with many opportunities for innovation. The Proceedings are composed of 3 volumes: Volume 1 - Information Systems, Control & Interoperability Volume 2 - Industrial Engineering Volume 3 - Operational Research * 3-volume set, containing 362 carefully reviewed and selected papers * presenting the state-of-the-art in international research and development in Information Control problems in Manufacturing