IEEE/CHMT International Electronic Manufacturing Technology Symposium PDF Download

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 426

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 538

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Author: Walt Trybula
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536

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Author: Rose Arny
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2184

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Author: Cornelius T. Leondes
Publisher: Elsevier
ISBN: 0080531458
Category : Computers
Languages : en
Pages : 2125

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This six-volume set presents cutting-edge advances and applications of expert systems. Because expert systems combine the expertise of engineers, computer scientists, and computer programmers, each group will benefit from buying this important reference work. An "expert system" is a knowledge-based computer system that emulates the decision-making ability of a human expert. The primary role of the expert system is to perform appropriate functions under the close supervision of the human, whose work is supported by that expert system. In the reverse, this same expert system can monitor and double check the human in the performance of a task. Human-computer interaction in our highly complex world requires the development of a wide array of expert systems. Expert systems techniques and applications are presented for a diverse array of topics including Experimental design and decision support The integration of machine learning with knowledge acquisition for the design of expert systems Process planning in design and manufacturing systems and process control applications Knowledge discovery in large-scale knowledge bases Robotic systems Geograhphic information systems Image analysis, recognition and interpretation Cellular automata methods for pattern recognition Real-time fault tolerant control systems CAD-based vision systems in pattern matching processes Financial systems Agricultural applications Medical diagnosis

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 420

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Author: Huseyin Sehitoglu
Publisher: ASTM International
ISBN: 0803118716
Category : AIIoys
Languages : en
Pages : 259

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Author: Glenn R. Blackwell
Publisher: CRC Press
ISBN: 1351835548
Category : Technology & Engineering
Languages : en
Pages : 937

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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Author: Zhihong Qian
Publisher: Springer Science & Business Media
ISBN: 3642257666
Category : Technology & Engineering
Languages : en
Pages : 849

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CSIE 2011 is an international scientific Congress for distinguished scholars engaged in scientific, engineering and technological research, dedicated to build a platform for exploring and discussing the future of Computer Science and Information Engineering with existing and potential application scenarios. The congress has been held twice, in Los Angeles, USA for the first and in Changchun, China for the second time, each of which attracted a large number of researchers from all over the world. The congress turns out to develop a spirit of cooperation that leads to new friendship for addressing a wide variety of ongoing problems in this vibrant area of technology and fostering more collaboration over the world. The congress, CSIE 2011, received 2483 full paper and abstract submissions from 27 countries and regions over the world. Through a rigorous peer review process, all submissions were refereed based on their quality of content, level of innovation, significance, originality and legibility. 688 papers have been accepted for the international congress proceedings ultimately.

Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234

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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.