Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
IEC/IEEE Standard for Higher Performance Protocol for the Standard Digital Interface for Programmable Instrumentation - Part 1: General (Adoption of IEEE Std 488.1-2003).
Author: IEC/IEEE Standard for Higher Performance Protocol for the Standard Digital Interface for Programmable Instrumentation - Part 1
Author: IEC/IEEE International Standard
Author: Institute of Electrical and Electronics EngineersPublisher:
ISBN:
Category : Digital control systems
Languages : en
Pages : 0
Book Description
Supersedes IEEE Std 488.1-2003. This standard applies to interface systems used to interconnect both programmable and nonprogrammable electronic measuring apparatus with other apparatus and accessories necessary to assemble instrumentation systems. It applies to the interface of instrumentation systems, or portions of them, in which the a. Data exchanged among the interconnected apparatus is digital (as distinct from analog) b. Number of devices that may be interconnected by one contiguous bus does not exceed 15 c. Total transmission path lengths over the interconnecting cables does not exceed 20 m d. Data rate among devices does not exceed 8 000 000 B/s The basic functional specifications of this standard may be used in digital interface applications that require longer distances, more devices, increased noise immunity, or combinations of these. Different electrical and mechanical specifications may be required (for example, symmetrical circuit configurations, high threshold logic, special connectors, or cable configurations) for these extended applications.
Electrical Codes, Standards, Recommended Practices and Regulations
Author: Robert J. AlonzoPublisher: William Andrew
ISBN: 0815520468
Category : Technology & Engineering
Languages : en
Pages : 511
Book Description
Electrical codes, standards, recommended practices and regulations can be complex subjects, yet are essential in both electrical design and life safety issues.This book demystifies their usage.It is a handbook of codes, standards, recommended practices and regulations in the United States involving electrical safety and design. Many engineers and electrical safety professionals may not be aware of all of those documents and their applicability. This book identifies those documents by category, allowing the ready and easy access to the relevant requirements. Because these documents may be updated on a regular basis, this book was written so that its information is not reliant on the latest edition or release of those codes, standards, recommended practices or regulations.No single document on the market today attempts to not only list the majority of relevant electrical design and safety codes, standards, recommended practices and regulations, but also explain their use and updating cycles. This book, one-stop-information-center for electrical engineers, electrical safety professionals, and designers, does. - Covers the codes, standards, recommended practices and regulations in the United States involving electrical safety and design, providing a comprehensive reference for engineers and electrical safety professionals - Documents are identified by category, enabling easy access to the relevant requirements - Not version-specific; information is not reliant on the latest edition or release of the codes, standards, recommended practices or regulations
Measurement and Instrumentation
Author: Alan S. MorrisPublisher: Academic Press
ISBN: 0123819628
Category : Science
Languages : en
Pages : 641
Book Description
Measurement and Instrumentation introduces undergraduate engineering students to the measurement principles and the range of sensors and instruments that are used for measuring physical variables. Based on Morris's Measurement and Instrumentation Principles, this brand new text has been fully updated with coverage of the latest developments in such measurement technologies as smart sensors, intelligent instruments, microsensors, digital recorders and displays and interfaces. Clearly and comprehensively written, this textbook provides students with the knowledge and tools, including examples in LABVIEW, to design and build measurement systems for virtually any engineering application. The text features chapters on data acquisition and signal processing with LabVIEW from Dr. Reza Langari, Professor of Mechanical Engineering at Texas A&M University. - Early coverage of measurement system design provides students with a better framework for understanding the importance of studying measurement and instrumentation - Includes significant material on data acquisition, coverage of sampling theory and linkage to acquisition/processing software, providing students with a more modern approach to the subject matter, in line with actual data acquisition and instrumentation techniques now used in industry. - Extensive coverage of uncertainty (inaccuracy) aids students' ability to determine the precision of instruments - Integrated use of LabVIEW examples and problems enhances students' ability to understand and retain content
IEEE Standard for Higher Performance Protocol for the Standard Digital Interface for Programmable Instrumentation
Author: Publisher:
ISBN: 9780738136929
Category : Digital control systems
Languages : en
Pages : 143
Book Description
Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author: Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-CohenPublisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
IEEE Std 488.1-2003 (Revision of IEEE Std 488.1-1987)
Author: Arts and Technology
Author: Giorgio De MichelisPublisher: Springer
ISBN: 3642379826
Category : Computers
Languages : en
Pages : 161
Book Description
This book constitutes the thoroughly refereed proceedings of the Third International Conference on Arts and Technology, ArtsIT 2013, held in Milano, Bicocca, Italy, in March. The 19 revised full papers presented were carefully selected and reviewed from 31 submissions and are organized in topical sections on: art and technology in action, music and technology in action, reflecting on art and technology, understanding the artistic practice, and at the boundaries.