High Performance Printed Circuit Boards PDF Download

Author: Charles A. Harper
Publisher: McGraw-Hill Professional Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 586

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Book Description
Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.

Author: Leonard Marks
Publisher: McGraw Hill Professional
ISBN: 0071500146
Category : Technology & Engineering
Languages : en
Pages : 433

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Book Description
Nuts-and-bolts guide to designing printed circuit assemblies Want to build circuit boards for today's smaller, faster electronics applications? This how-to tutorial puts a PCA design roadmap at your fingertips--valuable whether you're neophyte just starting out or an experienced designer, engineer or a manager associated with the electronics industry, as printed circuit assemblies are key building blocks in almost every commodity made today with any electronics content. In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.

Author: Robert Tarzwell
Publisher: Independently Published
ISBN: 9781731017352
Category :
Languages : en
Pages : 54

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Book Description
With currents as high as 600 amps, an engineer has the ability to design a printed circuit board that can carry large currents and support the fine traces and features of the computer circuits needed to drive the high power. The high power circuits of today can contain from 1 to 12 layers and also feature multiple levels of copper traces. Multiple levels means that one layer can have 12 oz. of copper for the heavy tracks and 1 oz. of fine featured traces for SMT circuitry, all interconnected. In fact, up to 5 copper levels have been manufactured, although not cheaply. Circuit boards from one manufacturer even feature very heavy copper traces that extend off the board to facilitate easy wiring.

Author: P.J.W. Noble
Publisher: Springer Science & Business Media
ISBN: 1468462342
Category : Science
Languages : en
Pages : 213

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Book Description
Assembly of 'difficult' components onto printed circuit boards is emerging as an important application area for small, fast industrial robots. For other robot tasks - for example paint spraying or arc welding - the applications engineer can rely on a body of published information representing decades of accumulated knowledge about the actual process being automated. But for the process of assembly relatively little systematically presented knowledge exists, mainly because so much manual assembly depends on extremely subtle co-ordination of hand, eye and brain which is hard to represent directly in engineering terms. As for the particular processes of electronic assembly, they have hardly been covered at all in the literature. Yet the design of a good PCB automation system depends crucially on the responsible engineer fully understanding every aspect of the process he or she is automating, whether working for the electronics manufacturer, an automation company, a research laboratory or a machine builder. The author of this book has had extensive practical experience in all these roles: as a source of great detail on most aspects of the electronic assembly process it will be of unique value not only to the robot specialist but well beyond that to anyone needing to understand how printed circuit boards are manufactured. P. G. Davey Acknowledgements The author is indebted to many companies and individuals from within the pcb assembly industry.

Author: Peter A. Engel
Publisher: Springer Science & Business Media
ISBN: 1461209153
Category : Science
Languages : en
Pages : 307

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Book Description
This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Author: R. S. Khandpur
Publisher: McGraw Hill Professional
ISBN: 0071589252
Category : Technology & Engineering
Languages : en
Pages : 717

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Book Description
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.

Author: Xing-Chang Wei
Publisher: CRC Press
ISBN: 1315305860
Category : Computers
Languages : en
Pages : 322

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Book Description
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Author: Christopher T. Robertson
Publisher: Prentice Hall Professional
ISBN: 9780130674814
Category : Technology & Engineering
Languages : en
Pages : 306

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Book Description
PCB design instruction and reference manual, all in one book, with in-depth explanation of the processes and tools used in modern PCB design Standards, formulas, definitions, and procedures, plus software to tie it all together.

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Book Description

Author: Charles A. Harper
Publisher: McGraw Hill Professional
ISBN: 9780070267138
Category : Technology & Engineering
Languages : en
Pages : 578

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Book Description
Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.