High-Performance Polymer... PDF Download

Author: Guy Rabilloud
Publisher: Editions OPHRYS
ISBN: 9782710810940
Category :
Languages : en
Pages : 382

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Book Description

Author: Guy Rabilloud
Publisher: Editions TECHNIP
ISBN: 9782710807193
Category : Technology & Engineering
Languages : en
Pages : 374

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Book Description
Summarizes the results published so far in the literature as an introduction to the third volume of the series, which will focus on the applications of heterocyclic polymers in the electronics industry. Considers the chemistry and applications of polyphenylquinoxalines and polymides, both of which have been used to make high-performance adhesives, composites, coatings, films, fibers, and foams that are now commercially available. Primarily a reference for materials scientists, polymer chemists, manufacturers of electronic components, and process engineers, but also potentially a textbook. Distributed in the US by Enfield Publishing and Distribution. Annotation copyrighted by Book News, Inc., Portland, OR

Author: Vikas Mittal
Publisher: John Wiley & Sons
ISBN: 1118171942
Category : Technology & Engineering
Languages : en
Pages : 454

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Book Description
This book describes advances in synthesis, processing, and technology of environmentally friendly polymers generated from renewable resources. With contents based on a wide range of functional monomers and contributions from eminent researchers, this volume demonstrates the design, synthesis, properties and applications of plant oil based polymers, presenting an elaborate review of acid mediated polymerization techniques for the generation of green polymers. Chemical engineers are provided with state-of-the-art information that acts to further progress research in this direction.

Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279

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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Author:
Publisher: Emerald Group Publishing
ISBN: 184663010X
Category : Electronic packaging
Languages : en
Pages : 72

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Book Description
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.

Author: Hanna Dodiuk
Publisher: William Andrew
ISBN: 0323899943
Category : Technology & Engineering
Languages : en
Pages : 1118

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Book Description
Handbook of Thermoset Plastics, Fourth Edition provides complete coverage of the chemical processes, manufacturing techniques and design properties of each polymer, along with its applications. This new edition has been expanded to include the latest developments in the field, with new chapters on radiation curing, biological adhesives, vitrimers, and 3D printing. This detailed handbook considers the practical implications of using thermoset plastics and the relationships between processing, properties and applications, as well as analyzing the strengths and weakness of different methods and applications.The aim of the book is to help the reader to make the right decision and take the correct action on the basis of informed analysis – avoiding the pitfalls the authors' experience has uncovered. In industry, the book supports engineers, scientists, manufacturers and R&D professionals working with plastics. The information included will also be of interest to researchers and advanced students in plastics engineering, polymer chemistry, adhesives and coatings. - Offers a systematic approach, guiding the reader through chemistry, processing methods, properties and applications of thermosetting polymers - Includes thorough updates that discuss current practice and the new developments on biopolymers, nanotechnology, 3D printing, radiation curing and biological adhesives - Uses case studies to demonstrate how particular properties make different polymers suitable for different applications - Covers end-use and safety considerations

Author: Philippe Cognard
Publisher: Elsevier
ISBN: 0080460593
Category : Technology & Engineering
Languages : en
Pages : 530

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Book Description
Contributions from more than 60 authors, each a well-known specialist in their field, have been co-ordinated to produce the most comprehensive Handbook of Adhesives and Sealants ever published. The handbook will be published as 8 volumes, over a period of 4 years and will contain over 2800 pages, rich with case studies, industrial applications and the latest research. It is a work in progress, enabling the latest new and important applications to be included as they happen. Volume 2 of Elsevier's Handbook of Adhesives & Sealants Series, General knowledge, application of adhesives & new curing techniques, covers the mechanisms of adhesion, its application, and drying and curing techniques. The volume is divided in to the following sections: • Theory of adhesion • Metering and dispensing • Design and calculation of bonded joints• Heat stable adhesives• UV curing • Flexible bonding and sealants Each contributing author is a scientist, practitioner, engineer, or chemist with an abundance of practical experience in their respective field, making this text an authoritative reference source for any materials scientist or engineer, whether in academia or industry.

Author: Sulaiman Khalifeh
Publisher: Elsevier
ISBN: 192788568X
Category : Technology & Engineering
Languages : en
Pages : 617

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Book Description
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 1437744621
Category : Science
Languages : en
Pages : 449

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Book Description
Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard-working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. - A handbook that truly focuses on the applied aspects of adhesives selection and applications: this is a book that won't gather dust on the shelf - Provides practical techniques for rendering materials surfaces adherable - Sector-based studies explore the specific issues for automotive and aerospace, medical, dental and electronics

Author: Reza Taherian
Publisher: William Andrew
ISBN: 012812542X
Category : Technology & Engineering
Languages : en
Pages : 434

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Book Description
Electrical Conductivity in Polymer-Based Composites: Experiments, Modelling and Applications offers detailed information on all aspects of conductive composites. These composites offer many benefits in comparison to traditional conductive materials, and have a broad range of applications, including electronic packaging, capacitors, thermistors, fuel cell devices, dielectrics, piezoelectric functions and ferroelectric memories. Sections cover the theory of electrical conductivity and the different categories of conductive composites, describing percolation threshold, tunneling effect and other phenomena in the field. Subsequent chapters present thorough coverage of the key phases in the development and use of conductive composites, including manufacturing methods, external parameters, applications, modelling and testing methods. This is an essential source of information for materials scientists and engineers working in the fields of polymer technology, processing and engineering, enabling them to improve manufacture and testing methods, and to benefit fully from applications. The book also provides industrial and academic researchers with a comprehensive and up-to-date understanding of conductive composites and related issues. - Explains the methods used in the manufacture and testing of conductive composites, and in the modeling of electrical conductivity - Contains specialized information on the full range of applications for conductive composites, including conductive adhesives or pastes - Brings scientists, engineers and researchers up-to-date with the latest advances in the field