Author: Win Hon TanPublisher:
ISBN:
Category :
Languages : en
Pages : 67
Book Description
High Performance Carbon Nanotubes for Thermal Interface Materials
Author: Win Hon TanCarbon Nanotubes for Thermal Interface Materials in Microelectronic Packaging
Author: Wei LinPublisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages :
Book Description
As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials.\r : The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials.\r : The major achievements are summarized.\r : 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon.\r : 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ~35% and ~65%, respectively, in tensile strength (~0.8 GPa) and modulus (~90 GPa) during tensile testing; an ~20% improvement in electrical conductivity (~80000 S m−1) was also reported. The mechanism of the microwave response of CNTs was discussed. Such an microwave annealing process has been extended to the preparation of reduced graphene oxide.\r : 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding.\r : 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ~30 mm2 s−1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ~27 and ~540 W m−1 K−1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ~1×10−7 m2 K W−1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging.\r : 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.
Novel Three-dimensional Carbon Nanotube Networks as High Performance Thermal Interface Materials
Author: Carbon Nanostructures as Thermal Interface Materials
Author: Muhammad Omar MemonPublisher:
ISBN:
Category : Carbon fibers
Languages : en
Pages : 133
Book Description
The power density of electronic packages has substantially increased. The thermal interface resistance involves more than 50% of the total thermal resistance in current high-power packages. The portion of the thermal budget spent on interface resistance is growing because die-level power dissipation densities are projected to exceed 100 W/cm2 in near future. There is an urgent need for advanced thermal interface materials (TIMs) that would achieve order-of-magnitude improvement in performance. Carbon nanotubes and nanofibers have received significant attention in the past because of its small diameter and high thermal conductivity. The present study is intended to overcome the shortcomings of commercially used thermal interface materials by introducing a compliant material which would conform to the mating surfaces and operate at higher temperatures. Thin film "labeled buckypaper" of CNF based Materials was processed and optimized. An experimental setup was designed to test processed materials in terms of thermal impedance as a function of load and materials density, thickness and thermal conductivity. Results show that the thermal impedance decreased in conjunction with the increasing heat-treatment temperature of CNFs. TIM using heat treated CNF showed a significant decrement of 54% in thermal impedance. Numerical simulations confirmed the validity of the experimental model. A parametric study was carried out which showed significant decrement in the thermal resistance with the decrease in TIM thickness. A transient spike power was carried out using two conditions; uniform heat pulse of 24 Watts, and power spikes of 24-96 Watts. The results show that heat treated CNF was 12% more temperature resistant than direct contact with more than 50% enhancement in heat transport across it.
High-Performance Carbon-Based Optoelectronic Nanodevices
Author: Yanjie SuPublisher: Springer Nature
ISBN: 9811654972
Category : Technology & Engineering
Languages : en
Pages : 199
Book Description
This book focuses on the photoelectric nanodevices based on carbon nanostructures, such as carbon nanotubes, graphene and related heterojunctions. The synthesis of carbon nanostructures and device fabrication are simply given. The interface charge transfer and the performance enhancement in the photodetectors and solar cells are comprehensively introduced. Importantly, carbon allotropes behave as high-mobility conductors or bandgap-tunable semiconductors depending on the atomic arrangements, the direct motivation is to fabricate all-carbon nanodevices using these carbon nanomaterials as building blocks. The photoelectric nanodevices based on all-carbon nanostructures have increasingly attracted attention in the future. The book offers a valuable reference guide to carbon-based photoelectric devices for researchers and graduate school students in the field. It will also benefit all researchers who investigate photoelectric nanodevices and photoelectric conversion with relevant frontier theories and concepts.
Thermal Management for Opto-electronics Packaging and Applications
Author: Xiaobing LuoPublisher: John Wiley & Sons
ISBN: 1119179297
Category : Technology & Engineering
Languages : en
Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Thermal Diffusivity Measurements on Metals and Ceramics at High Temperatures
Author: R. L. RudkinMolecular Dynamics Simulation of the Carbon Nanotube - Substrate Thermal Interface Resistance
Author: Daniel J. RogersPublisher:
ISBN:
Category : Heat
Languages : en
Pages :
Book Description
Thermal management is a key challenge to improving the performance of microelectronic devices. For many high performance applications, the thermal resistance between chip and heat sink may account for half of the total thermal budget. Chip-level heat dissipation is therefore a critical bottleneck to the development of advanced microelectronics with high junction temperatures. Recently aligned carbon nanotube arrays have been developed as possible next generation thermal interface materials to overcome this thermal limitation, however the thermal physics of these nanoscale interfaces remains unclear. In this thesis, the thermal interface resistance between a carbon nanotube and adjoining carbon, silicon, or copper substrate is investigated through non-equilibrium molecular dynamics simulation. Phonon transmission is calculated using a simplified form of the diffuse mismatch model with direct simulation of the phonon density of states. The results of theory and simulation are reported as a function of temperature in order to estimate the importance of anharmonicity and inelastic scattering. The results of this work provide a better understand of the mechanisms of thermal transport to assist future CNT TIM research and development.
Nanotube Superfiber Materials
Author: Michael B. JakubinekPublisher: Elsevier Inc. Chapters
ISBN: 0128091088
Category : Technology & Engineering
Languages : en
Pages : 49
Book Description
Individual carbon nanotubes (CNTs) have been reported to have the highest thermal conductivities of any known material. However, significant variability exists both for the reported thermal conductivities of individual CNTs and the thermal conductivities measured for macroscopic CNT assemblies (e.g. CNT films, buckypapers, arrays, and fibers), which range from comparable to metals to aerogel-like. This chapter reviews the current status of the field, summarizing a wide selection of experimental results and drawing conclusions regarding present limitations of the thermal conductivity of CNT assemblies and opportunities for improvement of the performance of nanotube superfiber materials.
Synthesis of Thermal Interface Materials Made of Metal Decorated Carbon Nanotubes and Polymers
Author: Marion Odul OkothPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materials (TIM) using metal decorated nanotubes as fillers. TIMs are very important in electronics because they act as a thermally-conductive medium for thermal transfer between the interface of a heat sink and an electronic package. The performance of an electronic package decreases with increasing operating temperature, hence, there exists a need to create a TIM which has high thermal conduction to reduce the operating temperature. The TIM in this study is made from metal decorated multi-walled carbon nanotubes (MWCNT) and Vinnapas®BP 600 polymer. The sample was functionalized using mild oxidative treatment with nitric acid (HNO3) or, with N-Methly-2-Pyrrolidone (NMP). The metals used for this experiment were copper (Cu), tin (Sn), and nickel (Ni). The metal nanoparticles were seeded using functionalized MWCNTs as templates. Once seeded, the nanotubes and polymer composites were made with or without sodium dodecylbenzene sulfonate (SDBS), as a surfactant. Thermal conductivity (k) measurement was carried out using ASTM D-5470 method at room temperature. This setup best models the working conditions of a TIM. The TIM samples made for this study showed promise in their ability to have significant increase in thermal conduction while retaining the polymer's mechanical properties. The highest k value that was obtained was 0.72 W/m-K for a well dispersed aligned 5 wt percent Ni@MWCNT sample. The Cu samples underperformed both Ni and Sn samples for the same synthesis conditions. This is because Cu nanoparticles were significantly larger than those of Ni and Sn. They were large enough to cause alloy scattering and too large to attach to the nanotubes. Addition of thermally-conductive fillers, such as exfoliated graphite, did not yield better k results as it sunk to the bottom during drying. The use of SDBS greatly increased the k values of the sample by reducing agglomeration. Increasing the amount of metal@MWCNT wt percent in the sample had negative or no effect to the k values. Shear testing on the sample shows it adheres well to the surface when pressure is applied, yet it can be removed with ease.