Author: E. R. G. Eckert
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 714
Book Description
Continuing the annual review work started in 1954 at the University of Minnesota's Heat Transfer Laboratory, this prestigous volume collates the reviews from the International Journal of Heat and Mass Transfer from 1976 through 1986. Together with a comprehensive author and subject index, it provides the tools for continuous improvements in the efficiency of engineering devices, including the recent awareness of the necessity to conserve energy and to find new energy sources. As an invaluable guide for locating existing literature on important topics, this work helps engineers and students keep abreast of recent developments in specialized research areas.
Heat Transfer Reviews 1976-1986
Author: E. R. G. Eckert
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 714
Book Description
Continuing the annual review work started in 1954 at the University of Minnesota's Heat Transfer Laboratory, this prestigous volume collates the reviews from the International Journal of Heat and Mass Transfer from 1976 through 1986. Together with a comprehensive author and subject index, it provides the tools for continuous improvements in the efficiency of engineering devices, including the recent awareness of the necessity to conserve energy and to find new energy sources. As an invaluable guide for locating existing literature on important topics, this work helps engineers and students keep abreast of recent developments in specialized research areas.
Publisher: Wiley-Interscience
ISBN:
Category : Science
Languages : en
Pages : 714
Book Description
Continuing the annual review work started in 1954 at the University of Minnesota's Heat Transfer Laboratory, this prestigous volume collates the reviews from the International Journal of Heat and Mass Transfer from 1976 through 1986. Together with a comprehensive author and subject index, it provides the tools for continuous improvements in the efficiency of engineering devices, including the recent awareness of the necessity to conserve energy and to find new energy sources. As an invaluable guide for locating existing literature on important topics, this work helps engineers and students keep abreast of recent developments in specialized research areas.
Heat Transfer Reviews, 1953-1969
Author: Ernst Rudolf Georg Eckert
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 560
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 560
Book Description
Advances in Heat Transfer
Author: James P. Hartnett
Publisher: Elsevier
ISBN: 0080526756
Category : Technology & Engineering
Languages : en
Pages : 302
Book Description
Advances in Heat Transfer
Publisher: Elsevier
ISBN: 0080526756
Category : Technology & Engineering
Languages : en
Pages : 302
Book Description
Advances in Heat Transfer
Pavement Materials for Heat Island Mitigation
Author: Hui Li
Publisher: Butterworth-Heinemann
ISBN: 0128034963
Category : Technology & Engineering
Languages : en
Pages : 389
Book Description
About 90 percent of this excessive heat is due to buildings and pavements that absorb and store solar heat (According to the Green Buildings Council). The only reference that focuses specifically on pavements, Pavement Materials for Heat Island Mitigation: Design and Management Strategies explores different advanced paving materials, their properties, and their associated advantages and disadvantages. Relevant properties of pavement materials (e.g. albedo, permeability, thermal conductivity, heat capacity and evaporation rate) are measured in many cases using newly developed methods. Includes experimental methods for testing different types of pavements materials Identifies different cool pavement strategies with their advantages and associated disadvantages Design and construct local microclimate models to evaluate and validate different cool pavement materials in different climate regions
Publisher: Butterworth-Heinemann
ISBN: 0128034963
Category : Technology & Engineering
Languages : en
Pages : 389
Book Description
About 90 percent of this excessive heat is due to buildings and pavements that absorb and store solar heat (According to the Green Buildings Council). The only reference that focuses specifically on pavements, Pavement Materials for Heat Island Mitigation: Design and Management Strategies explores different advanced paving materials, their properties, and their associated advantages and disadvantages. Relevant properties of pavement materials (e.g. albedo, permeability, thermal conductivity, heat capacity and evaporation rate) are measured in many cases using newly developed methods. Includes experimental methods for testing different types of pavements materials Identifies different cool pavement strategies with their advantages and associated disadvantages Design and construct local microclimate models to evaluate and validate different cool pavement materials in different climate regions
The International Journal of Mechanical Engineering Education
Author:
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 410
Book Description
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 410
Book Description
Applied Mechanics Reviews
A Review of High-speed, Convective, Heat-transfer Computation Methods
Author: Michael E. Tauber
Publisher:
ISBN:
Category : Aerodynamic heating
Languages : en
Pages : 44
Book Description
Publisher:
ISBN:
Category : Aerodynamic heating
Languages : en
Pages : 44
Book Description
Convective Heat Transfer and Transport Process, 1991
Author: Adrienne Lavine
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 96
Book Description
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 96
Book Description
Microscale Heat Transfer - Fundamentals and Applications
Author: S. Kakaç
Publisher: Springer Science & Business Media
ISBN: 1402033613
Category : Technology & Engineering
Languages : en
Pages : 517
Book Description
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.
Publisher: Springer Science & Business Media
ISBN: 1402033613
Category : Technology & Engineering
Languages : en
Pages : 517
Book Description
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.