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Author: Krishna Seshan Publisher: William Andrew ISBN: 1437778747 Category : Technology & Engineering Languages : en Pages : 411
Book Description
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. - A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications - Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries - The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics - Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM - Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry
Author: Krishna Seshan Publisher: William Andrew ISBN: 1437778747 Category : Technology & Engineering Languages : en Pages : 411
Book Description
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. - A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications - Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries - The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics - Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM - Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned 'Moore's Law' relating to the technology development cycle in the semiconductor industry
Author: John N. Helbert Publisher: Cambridge University Press ISBN: 0080946801 Category : Technology & Engineering Languages : en Pages : 1026
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: Paul H. Holloway Publisher: Cambridge University Press ISBN: 0080946143 Category : Technology & Engineering Languages : en Pages : 937
Book Description
This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Author: John N. Helbert Publisher: William Andrew ISBN: 0815517807 Category : Technology & Engineering Languages : en Pages : 1025
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: K. Byrappa Publisher: Cambridge University Press ISBN: 008094681X Category : Science Languages : en Pages : 898
Book Description
Quartz, zeolites, gemstones, perovskite type oxides, ferrite, carbon allotropes, complex coordinated compounds and many moreùall products now being produced using hydrothermal technology. Handbook of Hydrothermal Technology brings together the latest techniques in this rapidly advancing field in one exceptionally useful, long-needed volume. The handbook provides a single source for understanding how aqueous solvents or mineralizers work under temperature and pressure to dissolve and recrystallize normally insoluble materials, and decompose or recycle any waste material. The result, as the authors show in the book, is technologically the most efficient method in crystal growth, materials processing, and waste treatment. The book gives scientists and technologists an overview of the entire subject including: ò Evolution of the technology from geology to widespread industrial use. ò Descriptions of equipment used in the process and how it works. ò Problems involved with the growth of crystals, processing of technological materials, environmental and safety issues. ò Analysis of the direction of today's technology. In addition, readers get a close look at the hydrothermal synthesis of zeolites, fluorides, sulfides, tungstates, and molybdates, as well as native elements and simple oxides. Delving into the commercial production of various types, the authors clarify the effects of temperature, pressure, solvents, and various other chemical components on the hydrothermal processes.
Author: Shyam P Muraka Publisher: Elsevier ISBN: 0080521959 Category : Science Languages : en Pages : 459
Book Description
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Author: Lawrence Tannas Jr. Publisher: Elsevier ISBN: 0080946240 Category : Technology & Engineering Languages : en Pages : 600
Book Description
Large scale manufacturing of liquid crystal flat panel displays (LCDs) by Japan brought the world's attention to the existence of an enormous market potential exists when there are alternatives to the cathode ray tube (CRT). The Japanese have recognized that new display technologies are critical to making their products highly competitive in the world market. The CRT is losing market share to the solid-state flat panel display. Japan currently holds 90% of the market, and this book outlines opportunities in the former Soviet Union, where companies with the necessary technology are seeking partners, investment, and manufacturing opportunities. Entire cities that were once not even on the map due to their military mission, are now appearing, filled with state-of-the-art electronic technology. The book is developed from the reports issued by investigators based on their field visits to 33 sites in Japan, and 26 sites in Russia, Ukraine, and Belarus.
Author: Paul S. Ho Publisher: Springer Science & Business Media ISBN: 3642559085 Category : Technology & Engineering Languages : en Pages : 323
Book Description
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author: R. Winston Revie Publisher: John Wiley & Sons ISBN: 0470080329 Category : Technology & Engineering Languages : en Pages : 1299
Book Description
This book serves as a reference for engineers, scientists, and students concerned with the use of materials in applications where reliability and resistance to corrosion are important. It updates the coverage of its predecessor, including coverage of: corrosion rates of steel in major river systems and atmospheric corrosion rates, the corrosion behavior of materials such as weathering steels and newer stainless alloys, and the corrosion behavior and engineering approaches to corrosion control for nonmetallic materials. New chapters include: high-temperature oxidation of metals and alloys, nanomaterials, and dental materials, anodic protection. Also featured are chapters dealing with standards for corrosion testing, microbiological corrosion, and electrochemical noise.
Author: Jakob Reichel Publisher: John Wiley & Sons ISBN: 3527643923 Category : Science Languages : en Pages : 412
Book Description
This stimulating discussion of a rapidly developing field is divided into two parts. The first features tutorials in textbook style providing self-contained introductions to the various areas relevant to atom chip research. Part II contains research reviews that provide an integrated account of the current state in an active area of research where atom chips are employed, and explore possible routes of future progress. Depending on the subject, the length of the review and the relative weight of the 'review' and 'outlook' parts vary, since the authors include their own personal view and style in their accounts.
Author: Krishna Seshan
Author: Krishna Seshan
Author: John N. Helbert
Author: Paul H. Holloway
Author: John N. Helbert
Author: K. Byrappa
Author: Shyam P Muraka
Author: Lawrence Tannas Jr.
Author: Paul S. Ho
Author: R. Winston Revie
Author: Jakob Reichel