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Author: Shi-Yong Yang Publisher: Elsevier ISBN: 0128126418 Category : Technology & Engineering Languages : en Pages : 499
Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: Shi-Yong Yang Publisher: Elsevier ISBN: 0128126418 Category : Technology & Engineering Languages : en Pages : 499
Book Description
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. - Reviews the latest research, development and future prospective of polyimides - Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers - Presents a highly organized work that is composed of different sections that are easily compared
Author: Doug Wilson Publisher: Springer Science & Business Media ISBN: 9401096619 Category : Science Languages : en Pages : 307
Book Description
The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established on the bases of outstanding thermal stability, excellent mechanical properties and the ability to be fabricated into useful articles. Polyimides offer a versatility unparalleled in most other classes of macromolecules. Polymers can be prepared from a variety of starting materials, by a variety of synthetic routes. They can be tailor-made to suit specific applications. By judicious choice of starting materials, polymers can be made that offer variations in such properties as glass transition tempera ture, oxidative stability, toughness, adhesion, and permeability. It is this versatility that has led to the use of polyimides in a wide variety of applications. The electronics industry makes extensive use of poly imide films in, ior example, semiconductor applications. The leading polymer matrices for high temperature advanced composites are polyimides. High temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibres, foams, sealents and even membranes for the low energy separation of industrial gases.
Author: A.J. Kirby Publisher: iSmithers Rapra Publishing ISBN: 9780080419664 Category : Technology & Engineering Languages : en Pages : 166
Book Description
Polyimides have been available commercially for over 25 years, but are still frequently thought of as new materials, due largely to their performance and high technology end uses, which ensure that levels of research and development remain high. This detailed review describes the synthesis, properties, processing and applications of condensation, addition and hybrid polyimides. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database provides useful references for further reading.
Author: Publisher: ISBN: Category : Aeronautics Languages : en Pages : 1460
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author: Shi-Yong Yang
Author: Shi-Yong Yang
Author: N. R. Adsit
Author: Doug Wilson
Author: A. Adsit
Author: A.J. Kirby
Author: O'Brien
Author: Isaac M. Daniel
Author: Marvin B. Dow
Author: 
Author: