Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
Book Description
American Doctoral Dissertations
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
Book Description
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 768
Book Description
The Engineering Index Annual
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 2398
Book Description
Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 2398
Book Description
Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.
Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design
Author: Xiaowei Li
Publisher: Springer Nature
ISBN: 9811985510
Category : Computers
Languages : en
Pages : 318
Book Description
With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-purpose processors, network-on-chip (NoC) and deep learning accelerators, and present prototypes to demonstrate how 3S responds to in-field silicon degradation and recovery under various runtime faults caused by aging, process variations, or radical particles. Moreover, we demonstrate that 3S not only offers a powerful backbone for various on-chip fault-tolerant designs and implementations, but also has farther-reaching implications such as maintaining graceful performance degradation, mitigating the impact of verification blind spots, and improving chip yield. This book is the outcome of extensive fault-tolerant computing research pursued at the State Key Lab of Processors, Institute of Computing Technology, Chinese Academy of Sciences over the past decade. The proposed built-in on-chip fault-tolerant computing paradigm has been verified in a broad range of scenarios, from small processors in satellite computers to large processors in HPCs. Hopefully, it will provide an alternative yet effective solution to the growing reliability challenges for large-scale VLSI designs.
Publisher: Springer Nature
ISBN: 9811985510
Category : Computers
Languages : en
Pages : 318
Book Description
With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-purpose processors, network-on-chip (NoC) and deep learning accelerators, and present prototypes to demonstrate how 3S responds to in-field silicon degradation and recovery under various runtime faults caused by aging, process variations, or radical particles. Moreover, we demonstrate that 3S not only offers a powerful backbone for various on-chip fault-tolerant designs and implementations, but also has farther-reaching implications such as maintaining graceful performance degradation, mitigating the impact of verification blind spots, and improving chip yield. This book is the outcome of extensive fault-tolerant computing research pursued at the State Key Lab of Processors, Institute of Computing Technology, Chinese Academy of Sciences over the past decade. The proposed built-in on-chip fault-tolerant computing paradigm has been verified in a broad range of scenarios, from small processors in satellite computers to large processors in HPCs. Hopefully, it will provide an alternative yet effective solution to the growing reliability challenges for large-scale VLSI designs.
Reconfigurable Massively Parallel Computers
Author: Hungwen Li
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 280
Book Description
Offers guidance on three areas of the complex world of reconfigurable massively parallel computers - architecture, mapping algorithms to the architecture and fault-tolerance. The material is addressed to students and professionals interested in the exploitation of array processing.
Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 280
Book Description
Offers guidance on three areas of the complex world of reconfigurable massively parallel computers - architecture, mapping algorithms to the architecture and fault-tolerance. The material is addressed to students and professionals interested in the exploitation of array processing.
Advances in Computing and Information - ICCI '91
Author: Frank Dehne
Publisher: Springer Science & Business Media
ISBN: 9783540540298
Category : Computers
Languages : en
Pages : 762
Book Description
This volume contains papers presented at the Third International Conference on Computing and Information, ICCI '91, held at Carleton University in Ottawa, Canada, May 27-29, 1991. The conference was organized by the School of Computer Science at Carleton University, and was sponsored by the Natural Sciences and Engineering Research Council of Canada (NSERC) and Carleton University. ICCI '91 was an international forum for the presentation of original results in research, development, and applications in computing and information processing. The conference was aimed at both practitioners and theoreticians, and was organized into five streams: - Algorithms and complexity, - Databases and information systems, - Parallel processing and systems, - Distributed computing and systems, - Expert systems, artificial intelligence. This volume contains three invited papers, by E.C.R. Hehner, R.L. Probert, and S.J. Smith, and 71 selected papers.
Publisher: Springer Science & Business Media
ISBN: 9783540540298
Category : Computers
Languages : en
Pages : 762
Book Description
This volume contains papers presented at the Third International Conference on Computing and Information, ICCI '91, held at Carleton University in Ottawa, Canada, May 27-29, 1991. The conference was organized by the School of Computer Science at Carleton University, and was sponsored by the Natural Sciences and Engineering Research Council of Canada (NSERC) and Carleton University. ICCI '91 was an international forum for the presentation of original results in research, development, and applications in computing and information processing. The conference was aimed at both practitioners and theoreticians, and was organized into five streams: - Algorithms and complexity, - Databases and information systems, - Parallel processing and systems, - Distributed computing and systems, - Expert systems, artificial intelligence. This volume contains three invited papers, by E.C.R. Hehner, R.L. Probert, and S.J. Smith, and 71 selected papers.
Wafer Scale Integration
Author: Earl E. Swartzlander Jr.
Publisher: Springer Science & Business Media
ISBN: 1461316219
Category : Technology & Engineering
Languages : en
Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Publisher: Springer Science & Business Media
ISBN: 1461316219
Category : Technology & Engineering
Languages : en
Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Index to IEEE Publications
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1476
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1476
Book Description
Documentation Abstracts
Proceedings, ... International Symposium on VLSI Design
Author:
Publisher:
ISBN:
Category : Electronic digital computers
Languages : en
Pages : 492
Book Description
Publisher:
ISBN:
Category : Electronic digital computers
Languages : en
Pages : 492
Book Description
Defect and Fault Tolerance in VLSI Systems
Author: C. H. Stapper
Publisher:
ISBN: 9781475799583
Category :
Languages : en
Pages : 332
Book Description
Publisher:
ISBN: 9781475799583
Category :
Languages : en
Pages : 332
Book Description